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ISL3172EIBZ PDF预览

ISL3172EIBZ

更新时间: 2024-02-07 15:26:14
品牌 Logo 应用领域
英特矽尔 - INTERSIL 驱动器接口集成电路光电二极管信息通信管理
页数 文件大小 规格书
19页 803K
描述
【15kV ESD Protected, 3.3V, Full Fail-safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers

ISL3172EIBZ 技术参数

生命周期:Unknown零件包装代码:MSOP, SOIC
包装说明:MSOP-8针数:8, 8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:7.38差分输出:YES
驱动器位数:1高电平输入电流最大值:0.000002 A
输入特性:DIFFERENTIAL SCHMITT TRIGGER接口集成电路类型:LINE TRANSCEIVER
接口标准:EIA-422; EIA-485JESD-30 代码:S-PDSO-G8
JESD-609代码:e3长度:3 mm
湿度敏感等级:2功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C最小输出摆幅:1.5 V
最大输出低电流:0.004 A封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP8,.19
封装形状:SQUARE封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified最大接收延迟:120 ns
接收器位数:1座面最大高度:1.1 mm
子类别:Line Driver or Receivers最大压摆率:0.8 mA
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30最大传输延迟:700 ns
宽度:3 mmBase Number Matches:1

ISL3172EIBZ 数据手册

 浏览型号ISL3172EIBZ的Datasheet PDF文件第13页浏览型号ISL3172EIBZ的Datasheet PDF文件第14页浏览型号ISL3172EIBZ的Datasheet PDF文件第15页浏览型号ISL3172EIBZ的Datasheet PDF文件第16页浏览型号ISL3172EIBZ的Datasheet PDF文件第17页浏览型号ISL3172EIBZ的Datasheet PDF文件第18页 
ISL3170E,ISL3171E,ISL3172E,ISL3173E,ISL3174E,ISL3175E,ISL3176E,ISL3177E,ISL3178E  
Small Outline Plastic Packages (SOIC)  
M14.15 (JEDEC MS-012-AB ISSUE C)  
N
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC  
INDEX  
0.25(0.010)  
M
B M  
H
PACKAGE  
AREA  
E
INCHES  
MILLIMETERS  
-B-  
SYMBOL  
MIN  
MAX  
MIN  
1.35  
0.10  
0.33  
0.19  
8.55  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
8.75  
4.00  
NOTES  
A
A1  
B
C
D
E
e
0.0532  
0.0040  
0.013  
0.0688  
0.0098  
0.020  
-
1
2
3
L
-
SEATING PLANE  
A
9
0.0075  
0.3367  
0.1497  
0.0098  
0.3444  
0.1574  
-
-A-  
o
h x 45  
D
3
4
-C-  
α
0.050 BSC  
1.27 BSC  
-
e
A1  
C
H
h
0.2284  
0.0099  
0.016  
0.2440  
0.0196  
0.050  
5.80  
0.25  
0.40  
6.20  
0.50  
1.27  
-
B
0.10(0.004)  
5
0.25(0.010) M  
C
A M B S  
L
6
N
α
14  
14  
7
NOTES:  
o
o
o
o
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 0 12/93  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. DimensionEdoesnotincludeinterleadflashorprotrusions. Interlead  
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6307.2  
August 28, 2006  
19  

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