Datasheet > ISD5116EYI

ISD5116EYI

更新时间： 2024-01-28 02:58:27

品牌	Logo	应用领域
新唐 - NUVOTON		光电二极管商用集成电路
页数	文件大小	规格书
90页	678K
描述
SINGLE-CHIP

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技术参数
数据手册

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ISD5116EYI 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
零件包装代码：	TSOP	包装说明：	TSOP1, TSSOP28,.53,22
针数：	28	Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01	风险等级：	5.33
应用：	ANSWERING MACHINE	商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码：	R-PDSO-G28	长度：	11.8 mm
功能数量：	1	端子数量：	28
片上内存类型：	FLASH	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	TSOP1	封装等效代码：	TSSOP28,.53,22
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE, THIN PROFILE
电源：	3 V	认证状态：	Not Qualified
最长读取时间：	960 s	座面最大高度：	1.2 mm
子类别：	Audio Synthesizer ICs	最大压摆率：	40 mA
最大供电电压 (Vsup)：	3.3 V	最小供电电压 (Vsup)：	2.7 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子形式：	GULL WING
端子节距：	0.55 mm	端子位置：	DUAL
宽度：	8 mm

ISD5116EYI 数据手册

ISD5100 SERIES

6.5. Digital Mode .............................................................................................................................36

6.5.1

6.5.2

6.5.3

6.5.4

Erasing Digital Data..........................................................................................................36

Writing Digital Data...........................................................................................................36

Reading Digital Data.........................................................................................................37

Example Command Sequences.......................................................................................37

6.6. Pin Details................................................................................................................................48

6.6.1

6.6.2

6.6.3

6.6.4

Digital I/O Pins ..................................................................................................................48

Analog I/O Pins.................................................................................................................50

Power and Ground Pins....................................................................................................54

PCB Layout Examples......................................................................................................55

7. TIMING DIAGRAMS ........................................................................................................................57

7.1

7.2

7.3

I²C Timing Diagram..................................................................................................................57

Playback and Stop Cycle.........................................................................................................59

Example of Power Up Command (first 12 bits) .......................................................................60

8. ABSOLUTE MAXIMUM RATINGS ..................................................................................................61

9. ELECTRICAL CHARACTERISTICS................................................................................................63

9.1. General Parameters.................................................................................................................63

9.2. Timing Parameters...................................................................................................................64

9.3. Analog Parameters ..................................................................................................................66

9.4. Characteristics of The I²C Serial Interface...............................................................................70

9.5. I²C Protocol..............................................................................................................................73

10. TYPICAL APPLICATION CIRCUIT .................................................................................................75

11. PACKAGE SPECIFICATION...........................................................................................................76

11.1. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC .....................76

11.2. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 ...............................77

11.3. 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)............................................78

11.4. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ..............................................................79

11.5. ISD5116 Die Information..........................................................................................................80

11.6. ISD5108 Die Information..........................................................................................................82

11.7. ISD5104 Die Information..........................................................................................................84

11.8. ISD5102 Die Information..........................................................................................................86

12. ORDERING INFORMATION ...........................................................................................................88

13. VERSION HISTORY........................................................................................................................89

Publication Release Date: Oct 31, 2008

- 3 -

Revision 1.42

1 234 5 6 7...90

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与ISD5116EYI相关器件

型号	品牌	描述	获取价格	数据表
ISD5116P	WINBOND	Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Cap	获取价格
ISD5116PY	WINBOND	Speech Synthesizer With RCDG, 960s, CMOS, PDIP28, 0.600 MM INCH, LEAD FREE, PLASTIC, DIP-2	获取价格
ISD5116PY	NUVOTON	SINGLE-CHIP 1TO16 MINUTES DURATION VOICE RECORD/PLAYBAC VOICE DEVICES WITH DIGITAL STORAGE	获取价格
ISD5116PYI	NUVOTON	SINGLE-CHIP 1TO16 MINUTES DURATION VOICE RECORD/PLAYBAC VOICE DEVICES WITH DIGITAL STORAGE	获取价格
ISD5116S	WINBOND	Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Cap	获取价格
ISD5116SD	WINBOND	Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Cap	获取价格

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