ISD4004
TABLE OF CONTENTS
Table of contents.........................................................................................................2
1. GENERAL DESCRIPTION ....................................................................................3
2. FEATURES............................................................................................................3
3. BLOCK DIAGRAM.................................................................................................4
4. PIN CONFIGURATION..........................................................................................5
5. PIN DESCRIPTION ...............................................................................................6
6. FUNCTIONAL DESCRIPTION ............................................................................10
6.1.
6.2.
Detailed Description...................................................................................10
Serial Peripheral Interface (SPI) Description..............................................11
6.2.1 OPCODES ..............................................................................................12
6.2.2 SPI Diagrams..........................................................................................13
6.2.3 SPI Control and Output Registers...........................................................14
7. TIMING DIAGRAMS............................................................................................16
8. ABSOLUTE MAXIMUM RATINGS ......................................................................18
8.1.
Operating Conditions .................................................................................19
9. ELECTRICAL CHARACTERISTICS....................................................................20
9.1.
9.2.
9.3.
Parameters For Packaged Parts................................................................20
Parameters For Die....................................................................................23
SPI AC Parameters....................................................................................24
10.TYPICAL APPLICATION CIRCUIT......................................................................25
11.PACKAGING AND DIE INFORMATION..............................................................28
11.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC).......................................28
11.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) .................................29
11.3. Die Information...........................................................................................30
12.ORDERING INFORMATION ...............................................................................32
13.REVISION HISTORY...........................................................................................33
Important Notice........................................................................................................34
Jun 28, 2021
Page 2 of 34
Rev1.5