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ISD4004-12MEY PDF预览

ISD4004-12MEY

更新时间: 2024-02-12 03:47:48
品牌 Logo 应用领域
其他 - ETC 光电二极管商用集成电路
页数 文件大小 规格书
34页 417K
描述
IC VOICE REC/PLAY 12MIN 28-TSOP

ISD4004-12MEY 技术参数

生命周期:Transferred零件包装代码:TSOP
包装说明:TSOP1, TSSOP28,.53,22针数:28
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.32商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDSO-G28长度:11.8 mm
功能数量:1端子数量:28
片上内存类型:FLASH最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP28,.53,22
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
电源:3 V认证状态:Not Qualified
最长读取时间:720 s座面最大高度:1.2 mm
子类别:Audio Synthesizer ICs最大压摆率:40 mA
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.7 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.55 mm端子位置:DUAL
宽度:8 mm

ISD4004-12MEY 数据手册

 浏览型号ISD4004-12MEY的Datasheet PDF文件第1页浏览型号ISD4004-12MEY的Datasheet PDF文件第3页浏览型号ISD4004-12MEY的Datasheet PDF文件第4页浏览型号ISD4004-12MEY的Datasheet PDF文件第5页浏览型号ISD4004-12MEY的Datasheet PDF文件第6页浏览型号ISD4004-12MEY的Datasheet PDF文件第7页 
ISD4004  
TABLE OF CONTENTS  
Table of contents.........................................................................................................2  
1. GENERAL DESCRIPTION ....................................................................................3  
2. FEATURES............................................................................................................3  
3. BLOCK DIAGRAM.................................................................................................4  
4. PIN CONFIGURATION..........................................................................................5  
5. PIN DESCRIPTION ...............................................................................................6  
6. FUNCTIONAL DESCRIPTION ............................................................................10  
6.1.  
6.2.  
Detailed Description...................................................................................10  
Serial Peripheral Interface (SPI) Description..............................................11  
6.2.1 OPCODES ..............................................................................................12  
6.2.2 SPI Diagrams..........................................................................................13  
6.2.3 SPI Control and Output Registers...........................................................14  
7. TIMING DIAGRAMS............................................................................................16  
8. ABSOLUTE MAXIMUM RATINGS ......................................................................18  
8.1.  
Operating Conditions .................................................................................19  
9. ELECTRICAL CHARACTERISTICS....................................................................20  
9.1.  
9.2.  
9.3.  
Parameters For Packaged Parts................................................................20  
Parameters For Die....................................................................................23  
SPI AC Parameters....................................................................................24  
10.TYPICAL APPLICATION CIRCUIT......................................................................25  
11.PACKAGING AND DIE INFORMATION..............................................................28  
11.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC).......................................28  
11.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) .................................29  
11.3. Die Information...........................................................................................30  
12.ORDERING INFORMATION ...............................................................................32  
13.REVISION HISTORY...........................................................................................33  
Important Notice........................................................................................................34  
Jun 28, 2021  
Page 2 of 34  
Rev1.5  
 

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