ISD2590

更新时间： 2024-01-09 21:58:31

品牌	Logo	应用领域
华邦 - WINBOND		/
页数	文件大小	规格书
42页	377K
描述
ISD2560

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技术参数
数据手册

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ISD2590 技术参数

生命周期：	Transferred	包装说明：	DIE,
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.22	Is Samacsys：	N
应用：	PUSH BUTTON AND MESSAGE CUEING	商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码：	X-XUUC-N28	功能数量：	1
端子数量：	28	片上内存类型：	EEPROM
最高工作温度：	50 °C	最低工作温度：
封装主体材料：	UNSPECIFIED	封装代码：	DIE
封装形状：	UNSPECIFIED	封装形式：	UNCASED CHIP
认证状态：	Not Qualified	最长读取时间：	93 s
最大供电电压 (Vsup)：	6.5 V	最小供电电压 (Vsup)：	4.5 V
表面贴装：	YES	技术：	CMOS
温度等级：	COMMERCIAL	端子形式：	NO LEAD
端子位置：	UPPER	Base Number Matches：	1

ISD2590 数据手册

ISD2560/75/90/120

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

7.2. Operational Modes ..................................................................................................................... 11

7.2.1. Operational Modes Description............................................................................................ 12

8. TIMING DIAGRAMS.......................................................................................................................... 16

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19

9.1 Operating Conditions................................................................................................................... 20

10. ELECTRICAL CHARACTERISTICS............................................................................................... 21

10.1. Parameters For Packaged Parts .............................................................................................. 21

10.1.1. Typical Parameter Variation with Voltage and Temperature............................................. 24

10.2. Parameters For Die .................................................................................................................. 25

10.2.1. Typical Parameter Variation with Voltage and Temperature............................................. 28

10.3. Parameters For Push-Button Mode.......................................................................................... 29

11. TYPICAL APPLICATION CIRCUIT................................................................................................. 30

12. PACKAGE DRAWING AND DIMENSIONS.................................................................................... 35

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 36

12.3. 28-Lead 8x13.4MM Plastic Thin Small Outline Package (TSOP) Type 1................................ 37

12.4. ISD2560/75/95/120 Product Bonding Physical Layout (Die) ^[1]................................................ 38

14. VERSION HISTORY ....................................................................................................................... 41

- 4 -

1 2 345 6 7...42

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与ISD2590相关器件

型号	品牌	描述	获取价格	数据表
ISD2590E	WINBOND	Speech Synthesizer With RCDG, 90s, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28	获取价格
ISD2590EY	WINBOND	暂无描述	获取价格
ISD2590G	WINBOND	Speech Synthesizer With RCDG, 93s, CMOS, PDSO28	获取价格
ISD2590P	WINBOND	Speech Synthesizer With RCDG, 90s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	获取价格
ISD2590PRODUCTS	ETC		获取价格
ISD2590PY	WINBOND	Speech Synthesizer With RCDG, 90s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	获取价格

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