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ISD1730PY PDF预览

ISD1730PY

更新时间: 2024-01-13 23:33:35
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
24页 351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

ISD1730PY 技术参数

生命周期:Active包装说明:SOP,
Reach Compliance Code:compliant风险等级:5.09
Is Samacsys:N商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDSO-G28长度:17.93 mm
功能数量:1端子数量:28
片上内存类型:FLASH最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE最长读取时间:60 s
座面最大高度:2.64 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:YES
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:7.52 mmBase Number Matches:1

ISD1730PY 数据手册

 浏览型号ISD1730PY的Datasheet PDF文件第3页浏览型号ISD1730PY的Datasheet PDF文件第4页浏览型号ISD1730PY的Datasheet PDF文件第5页浏览型号ISD1730PY的Datasheet PDF文件第7页浏览型号ISD1730PY的Datasheet PDF文件第8页浏览型号ISD1730PY的Datasheet PDF文件第9页 
ISD1700 SERIES  
4 PINOUT CONFIGURATION  
Refer to Design Guide for details before performing any design or PCB layout.  
VCCD  
VSSD  
INT / RDY  
FWD  
LED  
RESET  
MISO  
ERASE  
MOSI  
REC  
SCLK  
PLAY  
FT  
SS  
ISD1700  
VSSA  
VCCA  
ROSC  
AnaIn  
MIC+  
VOL  
AGC  
MIC-  
VSSP2  
AUD / AUX  
VSSP1  
SP-  
VCCP  
Sp+  
SOIC / PDIP  
VSSA  
SS  
SCLK  
MOSI  
MISO  
AnaIn  
MIC+  
MIC-  
VSSP2  
RESET  
LED  
SP-  
VCCP  
VCCD  
ISD1700  
Sp+  
VSSP1  
VSSD  
INT / RDY  
FWD  
AUD/AUX  
AGC  
ERASE  
REC  
VOL  
ROSC  
PLAY  
FT  
VCCA  
TSOP  
- 6 -  

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