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ISD1616BXYI PDF预览

ISD1616BXYI

更新时间： 2024-01-03 00:01:29
品牌 Logo 应用领域
华邦 - WINBOND 音频合成器集成电路消费电路
页数 文件大小 规格书
23页 309K
描述
Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert Option

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ISD1616BXYI 技术参数

是否Rohs认证：符合生命周期：Transferred
零件包装代码：DIE包装说明：DIE,
针数：16Reach Compliance Code：unknown
HTS代码：8542.39.00.01风险等级：5.01
Is Samacsys：N商用集成电路类型：SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码：R-XUUC-N16功能数量：1
端子数量：16片上内存类型：FLASH
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：UNSPECIFIED封装代码：DIE
封装形状：RECTANGULAR封装形式：UNCASED CHIP
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
最长读取时间：30 s最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：2.4 V表面贴装：YES
温度等级：INDUSTRIAL端子形式：NO LEAD
端子位置：UPPER处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

ISD1616BXYI 数据手册

 浏览型号ISD1616BXYI的Datasheet PDF文件第17页浏览型号ISD1616BXYI的Datasheet PDF文件第18页浏览型号ISD1616BXYI的Datasheet PDF文件第19页浏览型号ISD1616BXYI的Datasheet PDF文件第20页浏览型号ISD1616BXYI的Datasheet PDF文件第21页浏览型号ISD1616BXYI的Datasheet PDF文件第22页 
ISD1600B SERIES  
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment  
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation  
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or  
sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could  
result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.  
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully  
indemnify Winbond for any damages resulting from such improper use or sales.  
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no  
representation or warranties with respect to the accuracy or completeness of the contents of this publication and  
reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.  
No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this  
publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability  
whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or  
infringement of any Intellectual property.  
The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any  
express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual  
property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for  
loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this  
documents, even if Winbond has been advised of the possibility of such damages.  
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only  
and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.  
The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in  
the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates  
SuperFlash®.  
This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder®  
product specifications. In the event any inconsistencies exist between the information in this and other product  
documentation, or in the event that other product documentation contains information in addition to the information in  
this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is  
subject to change without notice.  
Copyright© 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of  
Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks  
are properties of their respective owners.  
Publication Release Date: Jan. 23, 2007  
- 23 -  
Revision 1.2  
1...20212223

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与ISD1616BXYI相关器件

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ISD1616BXYI01 WINBOND Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O

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ISD1620B WINBOND Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O

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ISD1620BP WINBOND Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O

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ISD1620BP01 WINBOND Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O

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ISD1620BPI WINBOND Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O

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ISD1620BPI01 WINBOND Single-Message Single-Chip 6.6- to 40-Second Voice Record & Playback Devices with vAlert O

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