IR2103(S)PBF
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are
measured under board mounted and still air conditions.
Symbol
Definition
Min.
Max.
Units
High side floating absolute voltage
High side floating supply offset voltage
-0.3
625
V
V
B
V - 25
B
V + 0.3
B
S
V
V
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
HO
V - 0.3
V + 0.3
S
B
V
-0.3
-0.3
-0.3
25
CC
V
V
+ 0.3
+ 0.3
LO
CC
V
V
CC
Logic input voltage (HIN & ¯L¯IN¯)
IN
V/ns
W
dV /dt
Allowable offset supply voltage transient
Package power dissipation
—
—
—
50
1
S
8 lead PDIP
8 lead SOIC
8 lead PDIP
8 lead SOIC
P
D
@ T ≤ +25°C
0.625
125
200
150
150
300
A
—
—
Thermal resistance, junction to
ambient
°C/W
Rth
JA
Junction temperature
—
T
J
Storage temperature
-55
—
T
S
°C
Lead temperature (soldering, 10 seconds)
T
L
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within
the recommended conditions. The V offset rating is tested with all supplies biased at 15V differential.
S
Symbol
Definition
Min.
Max.
Units
High side floating absolute voltage
High side floating supply offset voltage
V
V
V + 10
V + 20
B
S
S
†
600
S
V
V
V
V
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
HO
S
B
V
20
10
0
CC
V
V
CC
LO
0
V
V
Logic input voltage (HIN & LIN)
Ambient temperature
IN
CC
°C
-40
125
T
A
†
Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip DT97-3 for
more details).
4
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© 2013 International Rectifier
April 18, 2013