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IPLU300N04S4R8XTMA1 PDF预览

IPLU300N04S4R8XTMA1

更新时间: 2024-01-08 20:08:35
品牌 Logo 应用领域
英飞凌 - INFINEON PC脉冲晶体管
页数 文件大小 规格书
9页 286K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET,

IPLU300N04S4R8XTMA1 技术参数

是否Rohs认证:符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:26 weeks风险等级:1.14
Samacsys Confidence:4Samacsys Status:Released
Samacsys PartID:658674Samacsys Pin Count:12
Samacsys Part Category:MOSFET (N-Channel)Samacsys Package Category:Other
Samacsys Footprint Name:IPLU300N04S4R8XTMA1-4Samacsys Released Date:2019-11-26 15:02:53
Is Samacsys:N雪崩能效等级(Eas):290 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:40 V最大漏极电流 (Abs) (ID):35 A
最大漏极电流 (ID):300 A最大漏源导通电阻:0.00077 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):300 pF
JESD-30 代码:R-MBCC-F2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
功耗环境最大值:2.8 W最大功率耗散 (Abs):89 W
最大脉冲漏极电流 (IDM):400 A子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:FLAT端子位置:SINGLE
晶体管元件材料:SILICONBase Number Matches:1

IPLU300N04S4R8XTMA1 数据手册

 浏览型号IPLU300N04S4R8XTMA1的Datasheet PDF文件第1页浏览型号IPLU300N04S4R8XTMA1的Datasheet PDF文件第2页浏览型号IPLU300N04S4R8XTMA1的Datasheet PDF文件第4页浏览型号IPLU300N04S4R8XTMA1的Datasheet PDF文件第5页浏览型号IPLU300N04S4R8XTMA1的Datasheet PDF文件第6页浏览型号IPLU300N04S4R8XTMA1的Datasheet PDF文件第7页 
IPLU300N04S4-R8  
Values  
Parameter  
Symbol  
Conditions  
Unit  
min.  
typ.  
max.  
Dynamic characteristics2)  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C iss  
C oss  
Crss  
t d(on)  
t r  
-
-
-
-
-
-
-
17650  
3790  
130  
50  
22945 pF  
4930  
V GS=0 V, V DS=25 V,  
f =1 MHz  
300  
-
-
-
-
ns  
22  
V DD=20 V, V GS=10 V,  
I D=300 A, R G=3.5 W  
t d(off)  
t f  
Turn-off delay time  
Fall time  
68  
61  
Gate Charge Characteristics2)  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
77  
27  
100 nC  
68  
Q gd  
V DD=32 V, I D=300 A,  
V GS=0 to 10 V  
Q g  
221  
4.4  
287  
V plateau  
Gate plateau voltage  
-
V
A
Reverse Diode  
Diode continous forward current2)  
Diode pulse current2)  
I S  
-
-
-
-
300  
T C=25 °C  
I S,pulse  
1200  
V GS=0 V, I F=100 A,  
T j=25 °C  
V SD  
Diode forward voltage  
-
0.9  
1.3  
V
Reverse recovery time2)  
t rr  
-
-
85  
-
-
ns  
V R=20 V, I F=50A,  
di F/dt =100 A/µs  
Reverse recovery charge2)  
Q rr  
132  
nC  
1) Current is limited by bondwire; with an R thJC = 0.35 K/W the chip is able to carry 697A at 25°C.  
2) Defined by design. Not subject to production test.  
3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
Rev. 1.0  
page 3  
2014-08-12  

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