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IDT71V3579YSA80B PDF预览

IDT71V3579YSA80B

更新时间: 2024-01-29 00:51:28
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艾迪悌 - IDT 计数器静态存储器
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IDT71V3579YSA80B 数据手册

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IDT71V3577S  
IDT71V3579S  
IDT71V3577SA  
IDT71V3579SA  
128K X 36, 256K X 18  
3.3V Synchronous SRAMs  
3.3V I/O, Flow-Through Outputs  
Burst Counter, Single Cycle Deselect  
Description  
Features  
The IDT71V3577/79 are high-speed SRAMs organized as  
128Kx36/256Kx18.TheIDT71V3577/79SRAMs containwrite,data,  
address andcontrolregisters.Therearenoregisters inthedataoutput  
path(flow-througharchitecture).InternallogicallowstheSRAMtogen-  
erateaself-timedwritebaseduponadecisionwhichcanbeleftuntilthe  
endofthe write cycle.  
128K x 36, 256K x 18 memory configurations  
Supports fast access times:  
Commercial:  
– 7.5ns up to 117MHz clock frequency  
CommercialandIndustrial:  
– 8.0ns up to 100MHz clock frequency  
– 8.5ns up to 87MHz clock frequency  
LBO input selects interleaved or linear burst mode  
Self-timedwritecyclewithglobalwritecontrol(GW),bytewrite  
enable (BWE), and byte writes (BWx)  
3.3V core power supply  
Power down controlled by ZZ input  
3.3V I/O  
Theburstmodefeatureoffersthehighestlevelofperformancetothe  
systemdesigner,astheIDT71V3577/79canprovidefourcyclesofdata  
forasingleaddress presentedtotheSRAM. Aninternalburstaddress  
counteracceptsthefirstcycleaddressfromtheprocessor,initiatingthe  
accesssequence.Thefirstcycleofoutputdatawillflow-throughfromthe  
arrayafteraclock-to-dataaccesstimedelayfromtherisingclockedgeof  
the same cycle. If burst mode operation is selected (ADV=LOW), the  
subsequentthreecyclesofoutputdatawillbeavailabletotheuseronthe  
next three rising clock edges. The order of these three addresses are  
definedbytheinternalburstcounterandtheLBO inputpin.  
Optional - Boundary Scan JTAG Interface (IEEE 1149.1  
compliant)  
Packaged in a JEDEC Standard 100-pin plastic thin quad  
The IDT71V3577/79 SRAMs utilize IDT’s latest high-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pinthinplasticquadflatpack(TQFP)aswellasa119ballgridarray  
(BGA) and a 165 fine pitch ball grid array (fBGA).  
flatpack(TQFP),119ballgridarray(BGA)and165finepitchball  
grid array  
PinDescriptionSummary  
A0-A17  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Synchronous  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
Chip Enable  
CE  
CS0, CS1  
OE  
Chip Selects  
Output Enable  
Global Write Enable  
Byte Write Enable  
Individual Byte Write Selects  
GW  
BWE  
(1)  
BW1, BW2, BW3, BW4  
CLK  
ADV  
ADSC  
ADSP  
LBO  
Clock  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Input  
Input  
I/O  
N/A  
Synchronous  
Synchronous  
Synchronous  
DC  
Burst Address Advance  
Address Status (Cache Controller)  
Address Status (Processor)  
Linear / Interleaved Burst Order  
Test Mode Select  
Test Data Input  
TMS  
TDI  
Synchronous  
Synchronous  
N/A  
TCK  
TDO  
Test Clock  
Test Data Output  
Synchronous  
Asynchronous  
Asynchronous  
Synchronous  
N/A  
JTAG Reset (Optional)  
Sleep Mode  
TRST  
ZZ  
I/O0-I/O31, I/OP1-I/OP4  
VDD, VDDQ  
Data Input / Output  
Core Power, I/O Power  
Ground  
Supply  
Supply  
VSS  
N/A  
NOTE:  
5280 tbl 01  
1. BW3 and BW4 are not applicable for the IDT71V3579.  
FEBRUARY 2005  
1
©2005IntegratedDeviceTechnology,Inc.  
DSC-5280/08  

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