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I1730XY PDF预览

I1730XY

更新时间: 2024-02-04 00:07:08
品牌 Logo 应用领域
华邦 - WINBOND 商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 60s, DIE

I1730XY 技术参数

生命周期:Obsolete零件包装代码:DIE
包装说明:DIE,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.61
商用集成电路类型:SPEECH SYNTHESIZER WITH RCDGJESD-30 代码:X-XUUC-N
功能数量:1片上内存类型:FLASH
最高工作温度:50 °C最低工作温度:
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:UNSPECIFIED封装形式:UNCASED CHIP
认证状态:Not Qualified最长读取时间:60 s
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.4 V
表面贴装:YES温度等级:COMMERCIAL
端子形式:NO LEAD端子位置:UPPER
Base Number Matches:1

I1730XY 数据手册

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ISD1700 SERIES  
1 GENERAL DESCRIPTION  
The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi-  
message voice record and playback device ideally suited to a variety of electronic systems. The  
message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the  
specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz  
with an external resistor, giving the user greater flexibility in duration versus recording quality for each  
application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices  
are optimized for a wide range of battery or line-powered applications.  
The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device  
incorporates a proprietary message management system that allows the chip to self-manage address  
locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a  
simple push-button environment. The devices include an on-chip oscillator (with external resistor  
control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, anti-  
aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width  
Modulation (PWM) Class D speaker driver, and current/voltage output.  
The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new  
message indicator. With vAlert, the device flashes an external LED to indicate that a new message is  
present. Besides, four special sound effects are reserved for audio confirmation of operations, such as  
“Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.  
Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique  
single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS)  
technology. Audio data are stored directly in solid-state memory without digital compression, providing  
superior quality voice and music reproduction.  
Voice signals can be fed into the chip through two independent paths: a differential microphone input  
and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM)  
Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a  
standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a  
single-ended current or voltage output to drive an external amplifier.  
While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power  
conservation after an operation is completed.  
In the SPI mode, the user has full control via the serial interface in operating the device. This includes  
random access to any location inside the memory array by specifying the start address and end  
address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register.  
This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default  
configuration for standalone mode can also be modified by storing the APC data into a non-volatile  
register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers  
have the control and flexibility to implement voice functionality into the high-end products.  
Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or  
Representatives to verify current or future specifications. Also refer to the website for any related application notes.  
Publication Release Date: January 23, 2007  
- 3 -  
Revision 1.3-S2  

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