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I1730XY PDF预览

I1730XY

更新时间: 2024-02-07 14:36:20
品牌 Logo 应用领域
华邦 - WINBOND 商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 60s, DIE

I1730XY 技术参数

生命周期:Obsolete零件包装代码:DIE
包装说明:DIE,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.61
商用集成电路类型:SPEECH SYNTHESIZER WITH RCDGJESD-30 代码:X-XUUC-N
功能数量:1片上内存类型:FLASH
最高工作温度:50 °C最低工作温度:
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:UNSPECIFIED封装形式:UNCASED CHIP
认证状态:Not Qualified最长读取时间:60 s
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.4 V
表面贴装:YES温度等级:COMMERCIAL
端子形式:NO LEAD端子位置:UPPER
Base Number Matches:1

I1730XY 数据手册

 浏览型号I1730XY的Datasheet PDF文件第1页浏览型号I1730XY的Datasheet PDF文件第3页浏览型号I1730XY的Datasheet PDF文件第4页浏览型号I1730XY的Datasheet PDF文件第5页浏览型号I1730XY的Datasheet PDF文件第6页浏览型号I1730XY的Datasheet PDF文件第7页 
ISD1700 SERIES  
TABLE OF CONTENTS  
1
2
3
4
5
6
GENERAL DESCRIPTION..............................................................................................................3  
FEATURES......................................................................................................................................4  
BLOCK DIAGRAM...........................................................................................................................5  
PINOUT CONFIGURATION............................................................................................................6  
PIN DESCRIPTION .........................................................................................................................7  
MODES OF OPERATIONS.............................................................................................................8  
6.1 Standalone (Push-Button) Mode .............................................................................................8  
6.2 SPI Mode .................................................................................................................................8  
7
TIMING DIAGRAMS........................................................................................................................8  
7.1 Standalone Operation..............................................................................................................8  
7.2 SPI Operation.........................................................................................................................12  
8
9
ABSOLUTE MAXIMUM RATINGS................................................................................................13  
8.1 Operating Conditions .............................................................................................................13  
ELECTRICAL CHARACTERISTICS .............................................................................................14  
9.1 DC Parameters ......................................................................................................................14  
9.2 AC Parameters.......................................................................................................................15  
10 TYPICAL APPLICATION CIRCUITS.............................................................................................16  
10.1 Good Audio Design Practices................................................................................................18  
11 PACKAGING .................................................................................................................................19  
11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19  
11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20  
11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21  
11.4 Die Information.......................................................................................................................21  
12 ORDERING INFORMATION.........................................................................................................22  
13 VERSION HISTORY......................................................................................................................23  
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