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I1730SYIR01 PDF预览

I1730SYIR01

更新时间: 2024-01-18 15:48:58
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 60s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28

I1730SYIR01 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:28
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.61商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDSO-G28JESD-609代码:e3
长度:17.93 mm功能数量:1
端子数量:28片上内存类型:FLASH
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
认证状态:Not Qualified最长读取时间:60 s
座面最大高度:2.64 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:7.52 mm
Base Number Matches:1

I1730SYIR01 数据手册

 浏览型号I1730SYIR01的Datasheet PDF文件第1页浏览型号I1730SYIR01的Datasheet PDF文件第3页浏览型号I1730SYIR01的Datasheet PDF文件第4页浏览型号I1730SYIR01的Datasheet PDF文件第5页浏览型号I1730SYIR01的Datasheet PDF文件第6页浏览型号I1730SYIR01的Datasheet PDF文件第7页 
ISD1700 SERIES  
TABLE OF CONTENTS  
1
2
3
4
5
6
GENERAL DESCRIPTION..............................................................................................................3  
FEATURES......................................................................................................................................4  
BLOCK DIAGRAM...........................................................................................................................5  
PINOUT CONFIGURATION............................................................................................................6  
PIN DESCRIPTION .........................................................................................................................7  
MODES OF OPERATIONS.............................................................................................................8  
6.1 Standalone (Push-Button) Mode .............................................................................................8  
6.2 SPI Mode .................................................................................................................................8  
7
TIMING DIAGRAMS........................................................................................................................8  
7.1 Standalone Operation..............................................................................................................8  
7.2 SPI Operation.........................................................................................................................12  
8
9
ABSOLUTE MAXIMUM RATINGS................................................................................................13  
8.1 Operating Conditions .............................................................................................................13  
ELECTRICAL CHARACTERISTICS .............................................................................................14  
9.1 DC Parameters ......................................................................................................................14  
9.2 AC Parameters.......................................................................................................................15  
10 TYPICAL APPLICATION CIRCUITS.............................................................................................16  
10.1 Good Audio Design Practices................................................................................................18  
11 PACKAGING .................................................................................................................................19  
11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19  
11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20  
11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21  
11.4 Die Information.......................................................................................................................21  
12 ORDERING INFORMATION.........................................................................................................22  
13 VERSION HISTORY......................................................................................................................23  
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