是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | TFBGA, BGA54,9X9,32 |
针数: | 54 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.02 |
风险等级: | 5.33 | 访问模式: | FOUR BANK PAGE BURST |
最长访问时间: | 5.4 ns | 其他特性: | AUTO/SELF REFRESH |
最大时钟频率 (fCLK): | 166 MHz | I/O 类型: | COMMON |
交错的突发长度: | 1,2,4,8 | JESD-30 代码: | S-PBGA-B54 |
JESD-609代码: | e1 | 长度: | 8 mm |
内存密度: | 134217728 bit | 内存集成电路类型: | SYNCHRONOUS DRAM |
内存宽度: | 16 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 54 |
字数: | 8388608 words | 字数代码: | 8000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 8MX16 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装等效代码: | BGA54,9X9,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3 V |
认证状态: | Not Qualified | 刷新周期: | 4096 |
座面最大高度: | 1.2 mm | 自我刷新: | YES |
连续突发长度: | 1,2,4,8,FP | 最大待机电流: | 0.002 A |
子类别: | DRAMs | 最大压摆率: | 0.2 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 8 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
HY5V26EFP-HI | HYNIX | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-54 |
获取价格 |
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HY5V26ELF-5I | HYNIX | Synchronous DRAM, 8MX16, 4.5ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, FBGA-54 |
获取价格 |
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HY5V26ELF-6 | HYNIX | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, FBGA-54 |
获取价格 |
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HY5V26ELF-7 | HYNIX | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, FBGA-54 |
获取价格 |
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HY5V26ELF-7I | HYNIX | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, FBGA-54 |
获取价格 |
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HY5V26ELF-H | HYNIX | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, FBGA-54 |
获取价格 |
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