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HY5V26FF-HI PDF预览

HY5V26FF-HI

更新时间: 2024-01-10 20:03:23
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器内存集成电路
页数 文件大小 规格书
12页 157K
描述
Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, FBGA-54

HY5V26FF-HI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA, BGA54,9X9,32
针数:54Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.92访问模式:FOUR BANK PAGE BURST
最长访问时间:5.4 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:S-PBGA-B54
长度:8 mm内存密度:134217728 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:54字数:8388608 words
字数代码:8000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:8MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA54,9X9,32封装形状:SQUARE
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
刷新周期:4096座面最大高度:1.2 mm
自我刷新:YES连续突发长度:1,2,4,8,FP
最大待机电流:0.002 A子类别:DRAMs
最大压摆率:0.1 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:8 mm
Base Number Matches:1

HY5V26FF-HI 数据手册

 浏览型号HY5V26FF-HI的Datasheet PDF文件第2页浏览型号HY5V26FF-HI的Datasheet PDF文件第3页浏览型号HY5V26FF-HI的Datasheet PDF文件第4页浏览型号HY5V26FF-HI的Datasheet PDF文件第5页浏览型号HY5V26FF-HI的Datasheet PDF文件第6页浏览型号HY5V26FF-HI的Datasheet PDF文件第7页 
128Mb Synchronous DRAM based on 2M x 4Bank x16 I/O  
Document Title  
4Bank x 2M x 16bits Synchronous DRAM  
Revision History  
Revision No.  
History  
Draft Date  
Remark  
1.0  
First Version Release  
June. 2007  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev. 1.0 / June. 2007  
1

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