Ohmite’s High Voltage Flip Chip Series incorporates high accu-
racy screen printing technology to achieve high voltage capability
in a stable flip chip SMD chip resistor package. The HVF Series
offers unmatched performance in comparison to standard chip
resistors. Its unique design provides lower voltage and tempera-
ture coefficients, less noise, tighter tolerances, better stability,
higher resistance values, and higher voltage ratings. HVF is
available in convenient 1206 and 2512 footprints.
HVF Series
Silicone
Aluminum Oxide
a
High Voltage
Flip Chip Film
T
W
F ꢀ ꢁ ꢂ u r ꢀ s
s ꢃ ꢀ C ꢄ F ꢄ C ꢁ ꢂ ꢄ ꢅ n s
• High voltage up to 3,000 volts
• Industry standard sizes
• Working temperature range
–55°C to 200°C
• Designed for automatic insertion
• Non-magnetic construction
Resistance Range:
L
1KΩ to 100GΩ
Ruthenium Oxide
Silver (PdAg)
ꢃoweꢆ
Resistance Tolerance: ±1% std.;
5% for HVF1206 100MΩ-10GΩ
more; 10% for 10GΩ+
Temperature Coefficient:
±100ppm std.
Coating: Silicone
Solder Pad Material: Silver
(PdAg)
Note: HVF Series should not be
used with tin-lead based solder
compositions. Only silver-based
solder compositions are recom-
mended. Care should be taken
in the selection of the solder flux
contained in the solder paste.
Some pastes are "corrosive" and
can damage the coating and
also the resistive layer during the
soldering process at high tem-
perature. PCBs must be properly
cleaned to remove any layers of
moisture containing halides below
the resistor.
std.
reꢇiꢇtaꢈce
raꢈge
ratiꢈg Voltage Dimeꢈꢇioꢈꢇ (iꢈ. ±±.±±08 Qty./
seꢆieꢇ
ꢂol. (mW8 ratiꢈg*
L
W
a ꢂ (max.8 reel**
D ꢀ r ꢁ ꢂ ꢄ n ꢉ
100
1K-100M 1% std. 300 1,500 0.128 0.063 0.018 0.028 1000
100M-10G 5%
10G-100G 10%
HVF12±6
70°
80
HVF2512 1K-100G 1% std. 1000 3,000 0.252 0.126 0.026 0.032 1000
60
40
20
0
*Use Ohm’s Law (V= √ P*R) to calculate maximum working voltage.
**Maximum available quantity per reel is 3,500 for 1206 size and 2,000 for
2512 size; call 1-866-9-OHMITE for details.
p e r f o r m a n c e d ata
0
50
100
150
200
Ambient Temperature, °C
Insulation Resistance >10,000 MΩ
500 Volt 25 °C 75% relative humidity
25 °C 75% relative humidity
Dielectric Strength
Thermal Shock
>1,000 Volt
V o lta g e c o e f f i c i e n t
o f r e s i s ta n c e
∆ R/R < 0.1% typ., MIL Std. 202, method 107
0.50% max. Cond. C (IEC 68 -2 -14)
Resistance
Range
VCR
Overload
∆ R/R < 0.1% typ., 1,5 x Pnom, 5 sec
0.50% max. (do not exceed max. voltage)
Series
1206
(-ppm/V)*
1K ..10MΩ
10M ..100MΩ
100M ..1GΩ
1GΩ .. 5GΩ
<3.20
<15.00
<29.00
<40.00
Moisture Resistance ∆ R/R < 0.1% typ., MIL Std. 202,
We recommend Halide Free
(or Halogen Free) solder pastes,
containing for example ROL0 or
similar.
0.50% max.
method 106 (IEC 68 -2 -3)
Load Life
∆ R/R < 0.1% typ., 1000 hours at rated power
0.50% max.
(IEC 115 -1)
2512
1K ..30MΩ
30M ..300MΩ
300M ..3GΩ
3GΩ .. 5GΩ
<0.80
<4.00
<7.00
<10.00
It is advisable for the PCB
layout to provide a slot, or air
gap, underneath the downward
facing resistor element, thereby
increasing insulation resistance
and reducing the possibility of
capacitive coupling to the PCB.
Under no circumstances should
any copper trace be present in the
layout directly under the resistive
element.
ta p e a n d r e e l s p e c i f i c at i o n s
Per EIA Std. RS-481
*Typical values. Voltage coefficient of
resistance strongly depends on the
resistance value. Contact Ohmite for
details.
0.157 ±.004
4.0 ±0.10
Tape
0.059 +.004/-0.0
1.5 +0.10/-0.0
0.032 ±.004
0.81 ±0.10
0.069 ±.004
1.75 ±0.10
0.079 ±.002
2.0 ±0.05
s ta n d a r d p a r t
n u m b e r s f o r H V f
0.315 ±.012
8.0 ±0.30
Ohms HVF1206--- HVF2512---
B
25K ---T2502FE ---T2502FE
50K ---T5002FE ---T5002FE
75K ---T7502FE ---T7502FE
100K ---T1003FE ---T1003FE
250K ---T2503FE ---T2503FE
0.138 ±.002
3.5 ±0.05
l a n d p at t e r n ( ꢀ ꢁ . )
Land pattern dimensions are for
reference only
0.157 ±.004
4.0 ±0.10
A
DIRECTION OF FEED
M
500K ---T5003FE ---T5003FE
1000K ---T1004FE ---T1004FE
1500K ---T1504FE ---T1504FE
2000K ---T2004FE ---T2004FE
N
L
2500K ---T2504FE ---T2504FE
5000K ---T5004FE ---T5004FE
O
7500K ---T7504FE ---T7504FE
1G ---T1007JE ---T1007FE
---T5007FE
size
M
n
ꢅ
L
Trailer
Components
Leader
230mm min.–560mm
max. May consist of
carrier and/or cover tape
followed by a minimum
of 160mm of carrier with
sealed cover tape
Minimum of 40
empty component
pockets sealed
with cover tape
HVF12±6 0.150 0.040 0.080 0.070
HVF2512 0.288 0.062 0.140 0.164
10G ---T1008JE
o r d e r i n g i n f o r m at i o n
0.56 max.
14.2 max.
Reel
Taping Code
blank = bulk package
T = tape & reel
RoHS
Compliant
0.512 ±.008
13.0 ±.20
H V F 1 2 0 6 T 1 0 0 4 J E T
High Voltage
Flip Chip
Series
TCR
Ohms
Tolerance
Case Size
1206
7.00 ±.079
178.0 ±2.0
1.969 min.
50.0 min.
T = 100 ppm First 3 digits are
V = 50 ppm* significant; last
digit specifies
F = 1%
G= 2%
J = 5%
2512
*Not available for all resistance
values; consult factory
number of zeros to
follow. Example:
1006 = 100MΩ
0.331 +.059/-0.0
8.4 +1.5/-0.0
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
Ohmite Mfg. Co.
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