HSMBJ5913 thru HSMBJ5956, e3
SILICON 3.0 Watt ZENER DIODE
S C O T T S D A L E D I V I S I O N
DESCRIPTION
PACKAGE
The HSMBJ5913-5956B series of surface mount 3.0 watt Zeners provides
voltage regulation in a selection from 3.3 to 200 volts with different tolerances
as identified by suffix letter on the part number. It is equivalent to the JEDEC
registered 1N5913 thru 1N5956B with identical electrical characteristics
except it is rated at 3.0 W instead of 1.5 W with the lower thermal resistance
features of this surface mount packaging. These plastic encapsulated Zeners
have a moisture classification of Level 1 with no dry pack required and are
also available in military equivalent screening levels by adding a prefix
identifier as further described in the Features section. Microsemi also offers
numerous other Zener products to meet higher and lower power applications.
DO-214AA
(see package notes)
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
Surface mount equivalent to 1N5913 to
1N5956B
•
Regulates voltage over a broad operating current
and temperature range
•
•
•
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
•
•
•
Wide selection from 3.3 to 200 V
Flexible axial-lead mounting terminals
Standard voltage tolerances are plus/minus 5%
with B suffix and 10 % with A suffix identification
Nonsensitive to ESD per MIL-STD-750 Method
1020
•
•
•
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
•
•
High specified maximum current (IZM) when
adequately heat sinking
RoHS Compliant devices available by adding
“e3’ suffix
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
Options for screening in accordance with MIL-
PRF-19500 for JAN, JANTX, JANTXV, and
JANS are available by adding MQ, MX, MV, or
MSP prefixes respectively to part numbers.
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
•
•
Power dissipation at 25ºC: 3.0 watts (also see
derating in Figure 1).
•
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
Operating and Storage temperature: -65ºC to
•
•
TERMINALS: C-bend (modified J-bend) leads, Tin-
Lead or RoHS Compliant annealed matte-Tin
plating solderable per MIL-STD-750, method 2026
+150ºC
Thermal Resistance: 15 ºC/W junction to lead,
or 80ºC/W junction to ambient when mounted on
FR4 PC board (1oz Cu) with recommended
footprint (see last page)
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
•
Steady-State Power: 3 watts at TL < 105oC, or
1.56 watts at TA = 25ºC when mounted on FR4
PC board with recommended footprint (also see
Figure1)
•
•
MARKING: Includes part number without prefix
(e.g. 5913B, 5926C, 5951D, etc.)
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
•
Forward voltage @200 mA: 1.2 volts
(maximum)
Solder Temperatures: 260 ºC for 10 s
(maximum)
•
•
WEIGHT: 0.1 grams
•
See package dimensions on last page
Copyright © 2006
3-12-2006 REV G
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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