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HS9-26C31RH-T PDF预览

HS9-26C31RH-T

更新时间: 2024-01-29 20:05:27
品牌 Logo 应用领域
英特矽尔 - INTERSIL 驱动器
页数 文件大小 规格书
3页 69K
描述
Radiation Hardened Quad Differential Line Driver

HS9-26C31RH-T 技术参数

是否无铅: 不含铅是否Rohs认证: 不符合
生命周期:Transferred零件包装代码:DFP
包装说明:DFP, FL16,.3针数:16
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.11
差分输出:YES驱动器位数:4
高电平输入电流最大值:0.000001 A输入特性:STANDARD
接口集成电路类型:LINE DRIVER接口标准:EIA-422
JESD-30 代码:R-CDFP-F16JESD-609代码:e0
功能数量:4端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
最小输出摆幅:2 V输出特性:3-STATE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:DFP
封装等效代码:FL16,.3封装形状:RECTANGULAR
封装形式:FLATPACK峰值回流温度(摄氏度):NOT APPLICABLE
电源:5 V认证状态:Not Qualified
最大接收延迟:筛选级别:MIL-PRF-38535 Class T
座面最大高度:2.92 mm子类别:Line Driver or Receivers
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT APPLICABLE总剂量:100k Rad(Si) V
最大传输延迟:28 ns宽度:6.73 mm
Base Number Matches:1

HS9-26C31RH-T 数据手册

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HS-26C31RH-T  
Die Characteristics  
DIE DIMENSIONS:  
BACKSIDE FINISH:  
2450µm x 4950µm x 533µm ±25.4µm  
(97 x 195 x 21mils ±1mil)  
Silicon  
PASSIVATION:  
METALLIZATION:  
M1: Mo/Tiw  
Type: SiO  
2
Thickness: 8kÅ ±1kÅ  
Thickness: 5800Å  
M2: Al/Si/Cu  
WORST CASE CURRENT DENSITY:  
2
< 2.0e5 A/cm  
Thickness: 10kÅ ±1kÅ  
TRANSISTOR COUNT:  
SUBSTRATE POTENTIAL:  
285  
Internally connected to V  
May be left floating.  
DD.  
PROCESS:  
Radiation Hardened CMOS, AVLSI  
Metallization Mask Layout  
HS-26C31RH  
AO (2)  
(14) DO  
(13) DO  
AO (3)  
ENABLE (4)  
(12) ENABLE  
BO (5)  
(11) CO  
BO (6)  
(10) CO  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
3

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