HMC615LP4 / 615LP4E
v02.1210
GaAs MMIC MIXER w/ INTEGRATED
LO AMPLIFIER, 2.3 - 4.0 GHz
Absolute Maximum Ratings
Harmonics of LO
RF / IF Input (Vcc= +5V)
LO Dꢁꢂvꢀ (Vcc= +5V)
BiAs
+27 dBm
nLO spuꢁ @ rF Poꢁt
+10 dBm
+7 Vdc
150°C
LO Fꢁꢀq. (GHz)
1
8
2
3
4
1
13
23
12
16
18
27
29
18
27
48
27
38
31
34
30
27
27
43
Junctꢂon Tꢀmpꢀꢁatuꢁꢀ
1.8
5
Contꢂnuouꢃ Pdꢂꢃꢃ (T = 85°C)
(derate 5.21 mW/°C abovꢀ 85°C)
2.6
11
15
7
0.339 W
10
3.4
Thꢀꢁmal rꢀꢃꢂꢃtancꢀ
(junctꢂon to gꢁound paddlꢀ)
192 °C/W
4.2
5
16
stoꢁagꢀ Tꢀmpꢀꢁatuꢁꢀ
Opꢀꢁatꢂng Tꢀmpꢀꢁatuꢁꢀ
-65 to +150°C
-40 to +85°C
LO = 0 dBm
All valuꢀꢃ ꢂn dBc bꢀlow ꢂnput LO lꢀvꢀl mꢀaꢃuꢁꢀd at rF poꢁt.
Typical Supply Current
eLeCTrOsTATiC seNsiTiVe DeViCe
OBserVe HANDLiNG PreCAUTiONs
Vcc
icc (mA)
65 mA
+5.0
Outline Drawing
NOTes:
1. LeADFrAMe MATeriAL: COPPer ALLOY
2. DiMeNsiONs Are iN iNCHes [MiLLiMeTers]
3. LeAD sPACiNG TOLerANCe is NON-CUMULATiVe.
4. PAD BUrr LeNGTH sHALL Be 0.15mm MAxiMUM.
PAD BUrr HeiGHT sHALL Be 0.05mm MAxiMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GrOUND LeADs AND GrOUND PADDLe MUsT Be
sOLDereD TO PCB rF GrOUND.
7. reFer TO HiTTiTe APPLiCATiON NOTe FOr sUGGesTeD
LAND PATTerN.
Package Information
Paꢁt Numbꢀꢁ
Packagꢀ Body Matꢀꢁꢂal
Lꢀad Fꢂnꢂꢃh
MsL ratꢂng
MsL1 [1]
Packagꢀ Maꢁkꢂng [3]
H615
xxxx
HMC615LP4
Low stꢁꢀꢃꢃ injꢀctꢂon Moldꢀd Plaꢃtꢂc[4]
Sn/Pb Solder
H615
xxxx
MsL1 [2]
HMC615LP4e
roHs-complꢂant Low stꢁꢀꢃꢃ injꢀctꢂon Moldꢀd Plaꢃtꢂc
100% mattꢀ sn
[1] Maꢄ pꢀak ꢁꢀflow tꢀmpꢀꢁatuꢁꢀ of 235 °C
[2] Maꢄ pꢀak ꢁꢀflow tꢀmpꢀꢁatuꢁꢀ of 260 °C
[3] 4-Dꢂgꢂt lot numbꢀꢁ xxxx
[4] Foꢁ avaꢂlabꢂlꢂty of Non-roHs HMC615LP4 pꢁoductꢃ plꢀaꢃꢀ contact Hꢂttꢂtꢀ Mꢂcꢁowavꢀ ꢃalꢀꢃ dꢂꢁꢀctly.
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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