Datasheet > HMC525A-Die

HMC525A-Die

更新时间： 2023-12-20 18:44:11

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
27页	574K
描述
4GHz至8.5 GHz宽带I/Q混频器

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HMC525A-Die 数据手册

Data Sheet

HMC525ACHIPS

OUTLINE DIMENSIONS

1.770

0.7737

0.100 × 0.151

0.3755

0.19985

0.150

0.0255

1.260

0.525

0.100 × 0.100

TOP VIEW

(CIRCUIT SIDE)

0.780

0.291

0.441

0.591

Figure 101. 12-Pad Bare Die [CHIP]

(C-12-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model¹

HMC525A

Temperature Range

−40°C to +85°C

Package Description

12-Pad Bare Die [CHIP]

Package Option

C-12-4

HMC525A-SX

−40°C to +85°C

C-12-4

¹The HMC525A and HMC525A-SX are RoHS compliant parts.

registered trademarks are the property of their respective owners.

D24049-10/20(0)

Rev. 0 | Page 27 of 27

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