Datasheet > HMC448_06

HMC448_06

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
HITTITE		输出元件倍频器
页数	文件大小	规格书
6页	323K
描述
GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT

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HMC448_06 数据手册

HMC448

v02.0606

GaAs MMIC x2 ACTIVE FREQUENCY

MULTIPLIER, 19 - 25 GHz OUTPUT

Absolute Maximum Ratings

Typical Supply Current vs. Vdd

RF Input (Vcc= +5V)

+20 dBm

Vdd (Vdc)

Idd (mA)

Supply Voltage (Vd1, Vd2)

Channel Temperature

+6.0 Vdc

175 °C

4.5

5.0

Continuous Pdiss (T= 85 °C)

(derate 7.1 mW/°C above 85 °C)

5.5

0.64 W

Note:

Thermal Resistance

(junction to die bottom)

141.7 °C/W

Multiplier will operate over full voltage range shown above.

Storage Temperature

Operating Temperature

-65 to +150 °C

-55 to +85 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

Die Packaging Information ^[1]

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

2. DIE THICKNESS IS .004”

[2]

Standard

Alternate

3. TYPICAL BOND PAD IS .004” SQUARE.

4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.

5. BOND PAD METALIZATION: GOLD

6. BACKSIDE METALIZATION: GOLD

7. BACKSIDE METAL IS GROUND.

GP-2

—

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] Reference this sufﬁx only when ordering alternate die

packaging.

8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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