Datasheet > HMC448-Die

HMC448-Die

更新时间： 2023-12-20 18:46:02

品牌	Logo	应用领域
亚德诺 - ADI		倍频器
页数	文件大小	规格书
6页	319K
描述
x2有源倍频器芯片，19 - 25 GHz Fout

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数据手册

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HMC448-Die 数据手册

HMC448

v01.1007

GaAs MMIC x2 ACTIVE FREQUENCY

MULTIPLIER, 19 - 25 GHz OUTPUT

Pad Description

Pad Number

Function

Description

Interface Schematic

RFIN

Pin is AC coupled and matched to 50 Ohms.

2, 3

Vd1, Vd2

Supply voltage 5V 0.5V.

RFOUT

GND

Pin is AC coupled and matched to 50 Ohms.

Die bottom must be connected to RF ground.

Assembly Diagram

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