HMC448

更新时间： 2024-02-07 07:13:38

品牌	Logo	应用领域
HITTITE		射频微波输出元件倍频器
页数	文件大小	规格书
6页	229K
描述
GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT

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HMC448 数据手册

HMC448

v00.0902

MICROWAVE CORPORATION

GaAs MMIC x2 ACTIVE FREQUENCY

MULTIPLIER, 19 - 25 GHz OUTPUT

Typical Supply Current vs. Vdd

Absolute Maximum Ratings

RF Input (Vcc= +5V)

+20 dBm

+6.0 Vdc

175 °C

Vdd (Vdc)

4.5

Idd (mA)

Supply Voltage (Vd1, Vd2)

Channel Temperature

5.0

Continuous Pdiss (T= 85 °C)

(derate 8.3 mW/°C above 85 °C)

5.5

744 mW

Note: Multiplier will operate over full voltage

range shown above.

Thermal Resistance

(junction to die bottom)

121 °C/W

Storage Temperature

Operating Temperature

-65 to +150 °C

-55 to +85 °C

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004” SQUARE.

4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.

5. BOND PAD METALIZATION: GOLD

6. BACKSIDE METALIZATION: GOLD

7. BACKSIDE METAL IS GROUND.

8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

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