Data Sheet
HMC329ALC3B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC329ALC3B
TOP VIEW
(Not to Scale)
12 11 10
1
2
3
9
8
7
GND
RF
GND
LO
GND
GND
4
5
6
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3, 4, 6, 7, 9 GND
Ground. These pins must be connected to RF/dc ground. See Figure 3 for the interface schematic.
LO Port. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the interface schematic.
IF Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block this port externally
using a series capacitor of a value chosen to pass the necessary IF frequency range. For operation to dc, this
pin must not source or sink more than 3 mA of current. Otherwise, die malfunction or die failure may result.
See Figure 5 for the interface schematic.
2
5
LO
IF
8
RF
NIC
EPAD
RF Port. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic.
Not Internally Connected. Connect these pins to RF/dc ground. Performance is not affected.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
10, 11, 12
INTERFACE SCHEMATICS
GND
IF
Figure 3. GND Interface Schematic
Figure 5. IF Interface Schematic
LO
RF
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
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