Datasheet > HMC329ALC3BTR-R5

HMC329ALC3BTR-R5

更新时间： 2024-01-17 13:44:26

品牌	Logo	应用领域
亚德诺 - ADI		局域网射频微波
页数	文件大小	规格书
23页	376K
描述
24 GHz to 32 GHz, GaAs, MMIC, Double Balanced Mixer

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技术参数
数据手册

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HMC329ALC3BTR-R5 技术参数

是否无铅：	含铅	是否Rohs认证：	符合
生命周期：	Active	针数：	12
Reach Compliance Code：	compliant	风险等级：	5.79
特性阻抗：	50 Ω	构造：	COMPONENT
最大变频损耗：	13.5 dB	最大输入功率 (CW)：	13 dBm
最大工作频率：	32000 MHz	最小工作频率：	24000 MHz
最高工作温度：	85 °C	最低工作温度：	-55 °C
射频/微波设备类型：	DOUBLE BALANCED

HMC329ALC3BTR-R5 数据手册

HMC329ALC3B

Data Sheet

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 2.

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Parameter

Rating

13 dBm

24 dBm

13 dBm

3 mA

RF Input Power

LO Input Power

IF Input Power

IF Source or Sink Current

Peak Reflow Temperature

Maximum Junction Temperature

_JAis the natural convection, junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

_JCis the junction to case thermal resistance.

260°C

175°C

Continuous Power Dissipation, P_DISS(T_A= 85°C,

Derate 3.7 mW/°C Above 85°C)

Operating Temperature Range

Storage Temperature Range

Lead Temperature (Soldering 60 sec)

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

Field-Induced Charged Device Model

(FICDM)

200 mW

Table 3. Thermal Resistance

Package Type

θ_JA

θ_JC

Unit

−55°C to +85°C

−65°C to +150°C

260°C

E-12-4¹

120

445

°C/W

¹Test Condition 1: JEDEC standard JESD51-2.

ESD CAUTION

1500 V, Class 1C

1250 V, Class IV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Rev. 0 | Page 4 of 23

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