HMC215LP4 / 215LP4E
v01.0111
GaAs MMIC MIXER w/ INTEGRATED
LO AMPLIFIER, 1.7 - 4.0 GHz
Typical Supply Current
Harmonics of LO
Vcc
icc (mA)
56 mA
nLO spuꢁ @ rF Poꢁt
+5.0
LO Fꢁꢀq. (GHz)
1
2
3
4
1.0
32
28
29
33
35
34
40
19
16
18
23
20
27
25
30
27
34
41
40
30
42
44
41
44
Absolute Maximum Ratings
1.4
10
1.8
2.2
rF / iF input (Vcc= +5V)
LO Dꢁꢂvꢀ (Vcc= +5V)
BiAs
+22 dBm
+10 dBm
+7 Vdc
2.6
3.0
Junctꢂon Tꢀmpꢀꢁatuꢁꢀ
150°C
LO = 4 dBm
Contꢂnuouꢃ Pdꢂꢃꢃ (T = 85°C)
(dꢀꢁatꢀ 5.21 mW/°C abovꢀ 85°C)
All valuꢀꢃ ꢂn dBc bꢀlow ꢂnput LO lꢀvꢀl mꢀaꢃuꢁꢀd at rF poꢁt.
0.339 W
Thꢀꢁmal rꢀꢃꢂꢃtancꢀ
(junctꢂon to gꢁound paddlꢀ)
192 °C/W
eLeCTrOsTATiC seNsiTiVe DeViCe
OBserVe HANDLiNG PreCAUTiONs
stoꢁagꢀ Tꢀmpꢀꢁatuꢁꢀ
Opꢀꢁatꢂng Tꢀmpꢀꢁatuꢁꢀ
-65 to +150°C
-40 to +85°C
Outline Drawing
NOTes:
1. LeADFrAMe MATeriAL: COPPer ALLOY
2. DiMeNsiONs Are iN iNCHes [MiLLiMeTers]
3. LeAD sPACiNG TOLerANCe is NON-CUMULATiVe.
4. PAD BUrr LeNGTH sHALL Be 0.15mm MAxiMUM.
PAD BUrr HeiGHT sHALL Be 0.05mm MAxiMUM.
5. PACKAGe WArP sHALL NOT exCeeD 0.05mm.
6. ALL GrOUND LeADs AND GrOUND PADDLe MUsT Be sOLDereD TO PCB rF GrOUND.
7. reFer TO HiTTiTe APPLiCATiON NOTe FOr sUGGesTeD LAND PATTerN.
Package Information
Paꢁt Numbꢀꢁ
Packagꢀ Body Matꢀꢁꢂal
Lꢀad Fꢂnꢂꢃh
MsL ratꢂng
MsL1 [1]
Packagꢀ Maꢁkꢂng [3]
H215
xxxx
HMC215LP4
Low stꢁꢀꢃꢃ injꢀctꢂon Moldꢀd Plaꢃtꢂc
sn/Pb soldꢀꢁ
H215
xxxx
MsL1 [2]
HMC215LP4e
roHs-complꢂant Low stꢁꢀꢃꢃ injꢀctꢂon Moldꢀd Plaꢃtꢂc
100% mattꢀ sn
[1] Maꢄ pꢀak ꢁꢀflow tꢀmpꢀꢁatuꢁꢀ of 235 °C
[2] Maꢄ pꢀak ꢁꢀflow tꢀmpꢀꢁatuꢁꢀ of 260 °C
[3] 4-Dꢂgꢂt lot numbꢀꢁ xxxx
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