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HMC157

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HMC157 技术参数

HMC157

MICROWAVE CORPORATION

GaAs MMIC FREQUENCY DOUBLER 1 - 2 GHz INPUT

V01.0700

FEBRUARY 2001

Handling Precautions

Follow these precautions to avoid permanent damage.

Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid

cleaning systems.

Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes ( see page 8 - 2 ).

Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and

bias cables to minimize inductive pick-up.

General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent twee-

zers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, twee-

zers, or fingers.

Mounting

The chip is not back-metallized and can be die mounted with electrically conductive epoxy. The mounting

surface should be clean and flat.

EpoxyDieAttach:

Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around

the perimeter of the chip once it is placed into position.

Cure epoxy per the manufacturer's schedule.

Wire Bonding

Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage

temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22

grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds.

Wirebonds should be started on the chip and terminated on the package. RF bonds should be as short as

possible.

12 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Web Site: www.hittite.com

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