Datasheet > HMC137_09

HMC137_09

更新时间： 2022-11-07 15:59:22

品牌	Logo	应用领域
HITTITE		/
页数	文件大小	规格书
6页	452K
描述
GaAs MMIC BI-PHASE MODULATOR, 6 - 11 GHz

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HMC137_09 数据手册

HMC137

v03.1007

GaAs MMIC BI-PHASE

MODULATOR, 6 - 11 GHz

Outline Drawing

NOTES:

Die Packaging Information ^[1]

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. TYPICAL BOND PAD IS .004” SQUARE.

3. BOND PAD SPACING IS .006” CENTER TO CENTER.

4. BACKSIDE METALIZATION: GOLD.

Standard

Alternate

WP-3 (Waffle Pack)

[2]

5. BACKSIDE METAL IS GROUND.

[1] Refer to the “Packaging ꢀnformation” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

6. BOND PAD METALIZATION: GOLD.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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