HMC1169
Data Sheet
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
5.10
5.00 SQ
4.90
0.30
0.25
0.18
PIN 1
PIN 1
INDIC ATOR AREA OPTIONS
INDICATOR
(SEE DETAIL A)
25
32
24
1
0.50
BSC
3.80
3.70 SQ
3.60
EXPOSED
PAD
17
8
16
9
0.45
0.40
0.35
0.20 MIN
TOP VIEW
BOTTOM VIEW
3.50 REF
0.90
0.85
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4.
Figure 18. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.85 mm Package Height
(HCP-32-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range MSL Rating2 Package Description
Package Option Qty.
HMC1169LP5E
HMC1169LP5ETR −40°C to +85°C
−40°C to +85°C
MSL3
MSL3
32-Lead Lead Frame Chip Scale Package [LFCSP]
32-Lead Lead Frame Chip Scale Package [LFCSP],
7”Tape and Reel
HCP-32-1
HCP-32-1
500
EV1HMC1169LP5
Evaluation Board
1 The HMC1169LP5E and HMC1169LP5ETR are RoHS Compliant Parts.
2 See the Absolute Maximum Ratings section, Table 2.
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D13947-0-2/18(A)
Rev. A | Page 12 of 12