Agilent Subminiature High Performance
TS AlGaAs Red LED Lamps
Data Sheet
Features
• Subminiature flat top package
Ideal for backlighting and light
piping applications
HLMP-P106/P156
HLMP-Q102/Q152
HLMP-Q106/Q156
• Subminiature dome package
Diffused dome for wide viewing
available. These include special
angle
Description
Flat Top Package
surface mount lead configura-
Non-diffused dome for high
tions, gull wing, yoke lead, or Z-
brightness
The HLMP-Pxxx Series flat top
lamps use an untinted, non-
diffused, truncated lens to
provide a wide radiation pattern
that is necessary for use in
backlighting applications. The
flat top lamps are also ideal for
use as emitters in light pipe
applications.
bend. Right angle lead bends at
2.54 mm (0.100 inch) and 5.08
mm (0.200 inch) center spacing
are available for through hole
mounting. For more information
refer to Standard SMT and
• Wide range of drive currents
500 µA to 50 mA
• Ideal for space limited
Applications
• Axial leads
• Available with lead configurations
for surface mount and through
hole PC board mounting
Through Hole Lead Bend
Options for Subminiature LED
Lamps data sheet.
Dome Packages
Technology
The HLMP-Qxxx Series dome
lamps, for use as indicators, use
a tinted, diffused lens to provide
a wide viewing angle with high
on-off contrast ratio. High
brightness lamps use an
untinted, nondiffused lens to
provide a high luminous inten-
sity within a narrow radiation
pattern.
These subminiature solid state
lamps utilize a highly optimized
LED material technology,
transparent substrate aluminum
gallium arsenide (TS AlGaAs).
This LED technology has a very
high luminous efficiency,
capable of producing high light
output over a wide range of
drive currents (500 µA to 50
mA). The color is deep red at a
dominant wavelength of 644 nm
deep red. TS AlGaAs is a flip-
chip LED technology, die
attached to the anode lead and
wire bonded to the cathode lead.
Available viewing angles are
75°, 35°, and 15°.
Lead Configurations
All of these devices are made by
encapsulating LED chips on
axial lead frames to form molded
epoxy subminiature lamp
packages. A variety of package
configuration options is