Datasheet > HKR1105W

HKR1105W

更新时间： 2024-02-03 13:55:53

品牌	Logo	应用领域
史丹利 - STANLEY		光电
页数	文件大小	规格书
2页	156K
描述
H 1105W Series, Dome Lens Type SMT LED

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技术参数
数据手册

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HKR1105W 技术参数

生命周期：	Obsolete	Reach Compliance Code：	compliant
HTS代码：	8541.40.20.00	风险等级：	5.84
颜色：	RED	颜色@波长：	Red
配置：	SINGLE	最大正向电流：	0.03 A
最大正向电压：	2.5 V	透镜类型：	WATER CLEAR
标称发光强度：	150.0 mcd	安装特点：	SURFACE MOUNT
功能数量：	1	端子数量：	2
最高工作温度：	100 °C	最低工作温度：	-40 °C
光电设备类型：	SINGLE COLOR LED	总高度：	1.85 mm
包装方法：	BULK	峰值波长：	660 nm
最大反向电压：	4 V	形状：	ROUND
尺寸：	1.6 mm	子类别：	Visible LEDs
表面贴装：	YES	T代码：	T-1
端子节距：	3.3 mm	视角：	30 deg
Base Number Matches：	1

HKR1105W 数据手册

ꢀ Ab so lu te Ma xim u m Ra tin gs

(Ta=25°C)

Orange

HAA

Yellow

Yellow-Green

Green

HPG

Pure Green

Red

Units

Item

HAY

HPY

HBG

HBR, HKR

Symbol

(HBR)

60 ,75

(HKR)

Power Dissipation

Forward Current

°C

Peak Forward Current

Reverse Voltage

Operating Temperature

Storage Temperature

Derating*

Topr

Tstg

-40 to +100

-40 to +120

-40 to +85

-40 to +100

0.42 (DC) 0.93 (Pulse)

∆I

1.0 (DC) 2.33 (Pulse)

mA/°C

* Ta=25°C, I applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.

The current derating for operation applies when the temperature is above 25°C for HBG and 75°C for HVR, HBR, HKR, HAA, HAY, HPY & HPG

ꢀ Ta p in g Sp ecifica tio n s for Reverse

for Standard

Mount Type

ꢀ Ta p in g Sp ecifica tio n s

Mount Type

4+0.1

(1.8)

(0.25)

4+0.1

φ 1.5 ^+0.1

(0.25)

φ 1.5^+0.1

(1.85)

Center

Hole

Quantity on tape:

2000 pieces

per reel

Quantity on tape:

2000 pieces

per reel

2+0.05

(φ 1.1)

2+0.05

(0.5)

(2.2)

(2.1)

(φ 1.1)

Center

Hole

Center

4+0.1

Cathode

Hole

2+0.5

4+0.1

21+0.8

13+0.2

Direction to pull

Cathode

9+0.3

180

11.4+1

Direction to pull

ꢀ Op er a tio n Cu r r en t Der a tin g Ch a r t (DC)

ꢀ Pr eca u tio n s

HAA, HAY, HPG,

HPY, HBR, HKR

Please follow these handling precautions to prevent damage to the chip and

ensure its reliability.

1. Soldering conditions:

HBG

• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)

Soldering time: 3 sec. max.

• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)

60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.

• Reflow Soldering:

°C

Operation Heating

240

Temperature

Cooling:

150

120

rise: 5°C/sec.

—5°C/sec.

Pre-heating

ꢀ Sp a tia l Distr ib u tio n

(X &Y)

60 to 120 sec.

5 sec. max

2. Cleaning:

• If cleaning is required, use the following solutions for less than 1 minute,

at less than 40°C.

• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.

• Effect of ultrasonic cleaning on the LED resin body differs depending on such

factors as the oscillator output, size of PCB and LED mounting method. The

use of ultrasonic cleaning should be enforced at proper output after confirming

there is no problem.

HKR, HAA, HAY, HPY, HPG, HBG

HBR

Product specifications subject to change without notice. PGH__1105W-0301

Sta n ley Electr ic Sa les o f Am er ica , In c.

2660 Ba rra nc a Pa rkwa y, Irvine , CA 92606 • Te l: 800-LED-LCD1 (533-5231) • Fa x: 949-222-0555

We b site : www.sta nle y-e le c tric .c om

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