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HE84G770(S) PDF预览

HE84G770(S)

更新时间: 2022-01-18 18:38:00
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HE84G770(S) 数据手册

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King Billion Electronics Co., Ltd  
HE84G770  
駿 億 電 子 股 份 有 限 公 司  
HE80004H SERIES  
27. Important Note  
1. Please note that ICE is different from IC which is your target chip. The ICE is a superset of  
HE80004H series IC, but each IC is a subset of ICE. Don’t use any hardware resource that your  
target chip doesn’t have them, especially RAM and register. KBIDS and compiler can’t prevent user  
from using some hardware resources that don’t exist in your target chip.  
2. To access “Data ROM”, users must update TPP first, TPH, and then TPL. Only follow this order, the  
pre-charge circuit of ROM will work correctly. The 5µs waiting is also necessary before LDV  
instruction is executed since Data ROM is a low speed ROM. User can’t emulate this accessing  
process in ICE, so 5µs delay should be added by firmware.  
3. Please bond the TSTP_P, RSTP_N and PRTD [7:0] with test points on PCB (can be soldered and  
probed) as you can, then some testing can be performed on PCB when it’s necessary. The TSTP_P is  
suggested to connect to ground by a 0 ohm resistor. The following figure is an example (Testing point  
with through hole).  
4. The LV5 must be lower than 12 Volt; otherwise the chip may be damaged.  
28. Updated History  
Version  
Date  
Revised History  
V1.0  
7/22/03 New Released  
1. Modify the 7-bit DAC block diagram  
V1.1 10/31/03  
2. Change the product name from HE84G770H to HE84G770  
October 31, 2003  
57  
Version:V1.1  
This specification is subject to change without notice. Please contact sales person for the latest version before use.  

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