King Billion Electronics Co., Ltd
HE84G770
駿 億 電 子 股 份 有 限 公 司
HE80004H SERIES
27. Important Note
1. Please note that ICE is different from IC which is your target chip. The ICE is a superset of
HE80004H series IC, but each IC is a subset of ICE. Don’t use any hardware resource that your
target chip doesn’t have them, especially RAM and register. KBIDS and compiler can’t prevent user
from using some hardware resources that don’t exist in your target chip.
2. To access “Data ROM”, users must update TPP first, TPH, and then TPL. Only follow this order, the
pre-charge circuit of ROM will work correctly. The 5µs waiting is also necessary before LDV
instruction is executed since Data ROM is a low speed ROM. User can’t emulate this accessing
process in ICE, so 5µs delay should be added by firmware.
3. Please bond the TSTP_P, RSTP_N and PRTD [7:0] with test points on PCB (can be soldered and
probed) as you can, then some testing can be performed on PCB when it’s necessary. The TSTP_P is
suggested to connect to ground by a 0 ohm resistor. The following figure is an example (Testing point
with through hole).
4. The LV5 must be lower than 12 Volt; otherwise the chip may be damaged.
28. Updated History
Version
Date
Revised History
V1.0
7/22/03 New Released
1. Modify the 7-bit DAC block diagram
V1.1 10/31/03
2. Change the product name from HE84G770H to HE84G770
October 31, 2003
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Version:V1.1
This specification is subject to change without notice. Please contact sales person for the latest version before use.