HD(X)
high density resistor networks
NEW
features
• Thin film construction
• 1.27, 1.0 mm pitch BGA compatible
• Stable resistor technology
• High resistor density
• Products with lead-free terminations meet
RoHS requirements
applications
• Bus signal termination
• Series termination
• Parallel termination
dimensions and construction
Bonding
Wire
Dimensions inches (mm)
Package Package
Code Power
Pins
48
c
L ±0.2 W ±0.2 w ±0.2 H ±0.1 p ±0.05
a
c ±0.2
L
1.2
S48
.622
(15.8)
.409
(10.4)
.295
(7.5)
.098
(2.5)
.025
(0.635)
.010
(0.25)
.028
(0.7)
W
watts
1.2
T48
.492
(12.5)
.319
(8.1)
.240
(6.1)
.039
(1.0)
.020
(0.5)
.009
(0.22)
.024
(0.6)
48
a
watts
p
Lead
H
w
Die
Pad
Wafer
Si
Molded
Resin
circuit schematic
n
n
1
1
HDI: 48 pins
HDB: 48 pins
ordering information
New Part #
HDI
S48
T
TEB
102
J
H
Package
Code
Termination
Material
Nominal
Resistance
Type
Packaging
Tolerance
T.C.R.
HDI
S48: SSOP
T48: TSSOP
T: Sn
TEB: 13"
embossed
tape
2 significant
digits + multiplier
J: ±5%
G: ±2%
H: 100ppm
HDB
1000 ohms =
code 102
For further information on packaging, please refer to Appendix C.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
12/09/05
64
KOA Speer Electronics, Inc. • Bolivar Drive • P.O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com