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HDB-M4-080M286U PDF预览

HDB-M4-080M286U

更新时间: 2023-06-15 00:00:00
品牌 Logo 应用领域
安费诺 - AMPHENOL /
页数 文件大小 规格书
5页 791K
描述
Board Connector, 80 Contact(s), 4 Row(s), Female, Straight, Solder Terminal,

HDB-M4-080M286U 数据手册

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Product Data Sheet  
Amphenol® HDB3 Series High Density  
Mother Board & Daughter Board Connectors  
No. 201-3  
Rectangular Interconnects with  
.070” X .060” Grid Spacing  
HDB 3 Mother Board  
Connector  
This new connector series incorporates a higher  
density contact pattern and lower mated height  
than Amphenol’s original Low Mating Force rectan-  
gular connectors while utilizing the same durable  
and reliable B3 contact.  
The B3 brush (bristle brush bunch) contact is  
comprised of multiple strands of high tensile wire  
that intermesh to create an electrical connection.  
HDB 3 Daughter Board  
Connector  
HDB3 CONNECTOR PERFORMANCE  
BENEFITS OF THE BRUSH CONTACT  
• Redundant current paths: 14-70 gas tight points  
of contact per mated bunch  
Durability:  
100,000 mating cycles  
Insertion/Extraction Force: 1.5 ounce typical per contact  
Operating Temperature:  
Current Rating:  
-65° to 150°C  
• Very smooth low friction interface  
2 amperes  
• Low mating forces: 1.5 oz. typical per contact,  
70-90% lower than conventional contacts  
• Long contact life: 100,000 cycles of mating and  
unmating without performance degradation  
• Documented intermittency free performance: No  
10 nano-second discontinuities during  
Hot swap 1 ampere maximum  
(load dependent)  
Insulation Resistance:  
5 gigaohms minimum  
Dielectric Withstanding  
Voltage:  
750 volts, 60 hertz, rms @ Sea  
Level 250 volts, 60 hertz,  
50,000,000 cycles of 0.010” displacement  
• Impervious to fretting  
rms @ 70,000 feet Elevation  
• Contact interface meets M55302/166 thru /171  
Solderability:  
Salt Fog:  
MIL-STD-202, Method 208  
48 Hours IAW MIL-STD-1344,  
method 1001, test condition B  
HDB3 FEATURES  
Humidity:  
Vibration:  
IAW MIL-STD-1344, method  
1002, type II  
Polarization:  
Keying:  
“D” shaped design  
4 hours in each of 3 mutually  
perpendicular axes IAW MIL-ST  
1344, method 2005,  
Optional keys offer 36 unique  
keying combinations  
Guide Pins  
Optional guide pins provide  
additional alignment  
test condition V, letter H  
Shock:  
1 shock along each of three  
mutually perpendicular axes IAW  
MIL-STD-1344, method 2004,  
test condition G  
Radial Misalignment:  
Capable of correcting up to a  
.020" initial radial misalign-  
ment  
Angular Misalignment: Capable of mating with up to a  
2° initial angular misalignment  
Data Rate:  
Capable of 3.125 Gbps (consult  
Amphenol for arrangement)  
@2009 Amphenol Corporation  
Printed in U.S.A.  
1/8/2009  
Amphenol  
1

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