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HCPL-5201#300 PDF预览

HCPL-5201#300

更新时间： 2024-01-31 18:47:10
品牌 Logo 应用领域
安捷伦 - AGILENT 输出元件光电
页数 文件大小 规格书
12页 294K
描述
Logic IC Output Optocoupler, 1-Element, 1500V Isolation, 5MBps, HERMETIC, GULL WING, CERAMIC, DIP-8

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HCPL-5201#300 技术参数

是否Rohs认证： 不符合生命周期：Transferred
包装说明：HERMETIC, GULL WING, CERAMIC, DIP-8Reach Compliance Code：unknown
ECCN代码：3A001.A.2.CHTS代码：8541.40.80.00
风险等级：5.24其他特性：TTL COMPATIBLE, HIGH RELIABILITY
配置：COMPLEX标称数据速率：5 MBps
最大正向电流：0.008 A最大绝缘电压：1500 V
JESD-609代码：e0安装特点：SURFACE MOUNT
元件数量：1最大通态电流：0.015 A
最高工作温度：125 °C最低工作温度：-55 °C
光电设备类型：LOGIC IC OUTPUT OPTOCOUPLER最大功率耗散：0.2 W
标称响应时间：3e-7 ns子类别：Optocoupler - IC Outputs
最小供电电压：4.5 V标称供电电压：20 V
表面贴装：YES端子面层：Tin/Lead (Sn/Pb)
Base Number Matches：1

HCPL-5201#300 数据手册

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2
which allows for direct connection  
to data buses. The output is non-  
inverting. The detector IC has an  
internal shield that provides a  
guaranteed common mode  
transient immunity of up to  
10,000 V/µs. Improved power  
supply rejection eliminates the  
need for special power supply  
bypass precautions.  
ceramic chip carrier (case outline  
2). Devices may be purchased  
with a variety of lead bend and  
plating options, see Selection  
Guide Table for details. Standard  
Microcircuit Drawing (SMD)  
parts are available for each  
package and lead style.  
specifications, and performance  
characteristics shown in the  
figures are identical for all parts.  
Occasional exceptions exist due  
to package variations and limita-  
tions and are as noted. Addition-  
ally, the same package assembly  
processes and materials are used  
in all devices. These similarities  
give justification for the use of  
data obtained from one part to  
represent other part’s per-  
Because the same electrical die  
(emitters and detectors) are used  
for each channel of each device  
listed in this data sheet, absolute  
maximum ratings, recommended  
operating conditions, electrical  
Package styles for these parts are  
8 pin DIP through hole (case  
outline P), 16 pin DIP flat pack  
(case outline F), and leadless  
formance for die related  
reliability and certain limited  
radiation test results.  
Selection Guide–Package Styles and Lead Configuration Options  
Package  
Lead Style  
Channels  
8 Pin DIP  
Through Hole  
1
8 Pin DIP  
Through Hole  
2
16 Pin Flat Pack  
Unformed Leads  
4
20 Pad LCCC  
Surface Mount  
2
Common Channel  
Wiring  
None  
V , GND  
CC  
V , GND  
CC  
None  
Agilent Part # & Options  
Commercial  
MIL-PRF-38534, Class H  
MIL-PRF-38534, Class K  
Standard Lead Finish  
Solder Dipped  
Butt Cut/Gold Plate  
Gull Wing/Soldered  
Class H SMD Part #  
Prescript for all below  
Either Gold or Solder  
Gold Plate  
HCPL-5200  
HCPL-5201  
HCPL-520K  
Gold Plate  
Option #200  
Option #100  
Option #300  
HCPL-5230  
HCPL-5231  
HCPL-523K  
Gold Plate  
Option #200  
Option #100  
Option #300  
HCPL-6250  
HCPL-6251  
HCPL-625K  
Gold Plate  
HCPL-6230  
HCPL-6231  
HCPL-623K  
Soldered Pads  
5962-  
5962-  
5962-  
8876903FX  
8876903FC  
5962-  
88769022X  
8876801PX  
8876801PC  
8876801PA  
8876801YC  
8876801YA  
8876801XA  
8876901PX  
8876901PC  
8876901PA  
8876901YC  
8876901YA  
8876901XA  
Solder Dipped  
88769022A  
Butt Cut/Gold Plate  
Butt Cut/Soldered  
Gull Wing/Soldered  
Class K SMD Part #  
Prescript for all below  
Either Gold or Solder  
Gold Plate  
5962-  
5962-  
5962-  
8876906KFX  
8876906KFC  
5962-  
8876905K2X  
8876802KPX  
8876802KPC  
8876802KPA  
8876802KYC  
8876802KYA  
8876802KXA  
8876904KPX  
8876904KPC  
8876904KPA  
8876904KYC  
8876904KYA  
8876904KXA  
Solder Dipped  
8876905K2A  
Butt Cut/Gold Plate  
Butt Cut/Soldered  
Gull Wing/Soldered  
1234567...12

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