Datasheet > HCPL-5200-200

HCPL-5200-200

更新时间： 2022-03-22 01:07:16

品牌	Logo	应用领域
惠普 - HP		光电栅
页数	文件大小	规格书
12页	296K
描述
Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers

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数据手册

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HCPL-5200-200 数据手册

Leaded Device Marking

Leadless Device Marking

Agilent LOGO

A QYYWWZ

XXXXXX

XXXXXXX

XXX XXX

50434

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

Agilent LOGO

Agilent P/N

PIN ONE/

ESD IDENT

A QYYWWZ

XXXXXX

XXXX

XXXXXX

XXX 50434

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

DSCC SMD*

Agilent FSCN*

Agilent P/N

DSCC SMD*

PIN ONE/

COUNTRY OF MFR.

Agilent FSCN*

COUNTRY OF MFR.

ESD IDENT

*QUALIFIED PARTS ONLY

Hermetic Optocoupler Options

Option

Description

100

Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for

details).

4.32 (0.170)

MAX.

0.51 (0.020)

1.14 (0.045)

MIN.

0.20 (0.008)

0.33 (0.013)

1.40 (0.055)

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MAX.

7.36 (0.290)

7.87 (0.310)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

200

300

Lead finish is solder dipped rather than gold plated. This option is available on commercial

and hi-rel product in 8 pin DIP. DSCC Drawing part numbers contain provisions for lead

finish. All leadless chip carrier devices are delivered with solder dipped terminals as a

standard feature.

Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for

details). This option has solder dipped leads.

4.57 (0.180)

MAX.

4.57 (0.180)

MAX.

0.20 (0.008)

0.33 (0.013)

0.51 (0.020)

MIN.

5° MAX.

1.40 (0.055)

1.65 (0.065)

9.65 (0.380)

9.91 (0.390)

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

1 2 345 6 7...12

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