Bill of Materials
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4
Bill of Materials
Table 2. PMP4976 Bill of Materials
Count RefDes
Value
10 mF
Description
Size
Part Number
C3216X5R1E106
C3216X5R1E106
C3216X5R1A226
C3216X5R1A226
C1608X7R1E105K
C1608X5R0J106KT
C1608X5R0J106KT
C4532X5R1A476M
Std
MFR
AREA
15390
15390
15390
15390
5650
2
C1
Capacitor, Ceramic, 25V, X5R, 20%
Capacitor, Ceramic, 25V, X5R, 20%
Capacitor, Ceramic, 10V, X5R, 20%
Capacitor, Ceramic, 10V, X5R, 20%
Capacitor, Ceramic, 25V, X7R, 10%
Capacitor, Ceramic, 6.3V, X5R, 10%
Capacitor, Ceramic, 6.3V, X5R, 10%
Capacitor, Ceramic, 10V, X5R, 20%
Capacitor, Ceramic, 10V, X5R, 20%
Capacitor, Ceramic, 6.3V, X5R, 20%
Capacitor, Ceramic, 6.3V, X5R, 20%
Capacitor, Ceramic, 10V, X5R, 20%
Capacitor, Ceramic, 6.3V, X5R, 20%
Capacitor, Ceramic, 6.3V, X5R, 20%
1206
1206
1206
1206
603
TDK
TDK
TDK
TDK
TDK
TDK
TDK
TDK
Std
C2
10 mF
2
C3
22 mF
C4
22 mF
1
2
C5
1 mF
C6
10 mF
603
5650
C7
10 mF
603
5650
1
2
2
2
C8
47 mF
1812
1210
402
43,360
83,600
C9
22 mF
C10
C11
C12
C13
C14
J1
2.2 mF
4.7 mF
22 mF
JDK105BJ225MV
JDK105BJ475MV
Std
Taiyo Yuden
Taiyo Yuden
Std
2800
402
2800
1210
402
83,600
2800
2.2 mF
4.7 mF
PTC36SAAN
2510-6002UB
JDK105BJ225MV
JDK105BJ475MV
PTC36SAAN
Taiyo Yuden
Taiyo Yuden
Sullins
402
2800
1
1
Header, Male 6-pin, 100mil spacing, (36-pin strip) 0.100 inch × 6
70000
J2
Connector, Male Straight 2×10 pin, 100mil
spacing, 4 Wall
0.338 × 0.788
2510-6002UB
3M
301.02
4
1
1
1
1
2
J3
PEC36SAAN
PTC36SAAN
6.8 mH
1 mH
Header, Male 5-pin, 100mil spacing, (36-pin strip) 0.100 inch × 5
PEC36SAAN
PTC36SAAN
Sullins
Sullins
Coiltronics
Coilcraft
FDK
FDK
Vishay
Fairchild
Std
60000
34100
90000
26,560
10160
10160
14105
37800
9100
JP1
L1
Header, 3-pin, 100mil spacing, (36-pin strip)
Inductor, SMT, 3.0A, 97 mΩ
Inductor, SMT, 1.6A, ±30%
Inductor, SMT, 0.7A, 230-mΩ
Inductor, SMT, 0.7A, 230-mΩ
MOSFET, P-ch, -12 V, 4 A, 51 mΩ
Transistor, NPN, 40V, 200mA, 625mW
Resistor, Chip, 1/16-W, 1%
Resistor, Chip, 1/16W, x%
0.100 × 3
0.276 × 0.276 inch HA3808-AL
L2
0.118 × 0.118
805
LPS3010-102NLC
L3
2.2 mH
2.2 mH
Si2335DS
2N3904
1M
MIPSZ20120D2R2
L4
805
MIPSZ20120D2R2
1
1
1
2
Q1
Q2
R1
R2
R3
R4
R5
R6
R7
R8
R9
U1
SOT23
TO-92
603
Si2335DS
2N3904
Std
10K
603
Std
Std
5,650
5,650
5,650
5650
10K
Resistor, Chip, 1/16W, x%
603
Std
Std
1
1
2
1M
Resistor, Chip, 1/16W, x%
603
Std
Std
1M
Resistor, Chip, 1/16W, 1%
603
Std
Std
10k
Resistor, Chip, 1/16W, 1%
603
Std
Std
5650
10k
Resistor, Chip, 1/16W, 1%
603
Std
Std
5650
2
1K
Resistor, Chip, 1/16W, x%
603
Std
Std
5,650
5,650
54289
1K
Resistor, Chip, 1/16W, x%
603
Std
Std
1
1
TPS62111RSA IC, Synchronous Step-Down Converter, 17V,
1.2A
QFN-16
TPS62111RSA
TI
U2
TPS62353YZG IC, 3MHz Synchronous Step Down Converter
with I2C, 800mA
CSP-12
TPS62353YZG
TI
12,000
1
1
U3
U4
TPS62232DRY IC, 3MHz Ultra Small Step Down Converter, x.x V QFN
TPS62231DRY IC, 3MHz Ultra Small Step Down Converter, x.x V QFN
TPS62232DRY
TPS62232DRY
TI
TI
6020
6020
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants. Failure to use clean flux is unacceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Reference designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's
components.
6
High-Vin, High-Efficiency Power Solution Using DC/DC Converters With DVFS
SLVA339A–June 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated