B-XES&F-XES&H-XES Series
General Specifications
Parameters
Conditions
Typical
50
Maximum
Units
Switching frequency
Operating temperature
Storage temperature
Max Case temperature
Cooling
100% load
KHz
℃
Full Load without Derating
-40 to +85
-40 to +125
℃
90
90
℃
Free air convection
%
Humidity
%
Case material
Plastic UL94-VO
Weight
3.8
g
Dimensions (L x W x H)
MTBF
1.25 x 0.34 x 0.53 inches
31.80 x 8.60 x 13.47 mm
>1 500 000 hrs (MIL-HDBK -217F, Ground Benign, t=+25 C)
NOTE: All specifications in this datasheet are measured at an ambient temperature of 25°C, humidity<75%, nominal input voltageand at rated output load
unless otherwise specified
Pin Out Specifications
Pin
1000VDC
3000 and 6000VDC
1
2
+V Input
N.C.
+V Input
-V Input
N.C.
3
N.C.
9
N.C.
N.C.
10
11
12
-V Output
+V Output
-V Input
-V Output
+V Output
N.C.
RoHS COMPLIANT INFORMATION
This series is compatible with RoHS soldering systems with a peak wave solder temperature
of 300°C for 10 seconds.
The pin termination finish on the SIP package type is Tin Plate, Hot Dipped over Matte Tin
with Nickel Preplate. The DIP types are Matte Tin over Nickel Preplate. Both types in this
series are backward compatible with Sn/Pb soldering systems.
Microdc Professional Power Module,Inc.
Tel:0086-20-86000646 E-mail:tech@microdc.cn
Website:http://www.microdc.cn
REACH COMPLIANT INFORMATION
This series has proven that this product does not contain harmful chemicals, it also has
harmful chemical substances through the registration, inspection and approval.
http://www.microdc.cn
Technical Enquiries-Email:tech@microdc.cn Tel:0086-20-86000646
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