Datasheet > H02N60S

H02N60S

更新时间： 2024-01-28 04:39:44

品牌	Logo	应用领域
HSMC		晶体晶体管功率场效应晶体管
页数	文件大小	规格书
6页	78K
描述
N-Channel Power Field Effect Transistor

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技术参数
数据手册

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H02N60S 技术参数

生命周期：	Obsolete	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.84
Base Number Matches：	1

H02N60S 数据手册

Spec. No. : MOS200504

Issued Date : 2005.05.01

Revised Date : 2005.09.28

Page No. : 3/6

HI-SINCERITY

MICROELECTRONICS CORP.

TO-252 Dimension

DIM

Min.

6.35

4.80

1.30

5.40

2.20

0.40

2.20

0.90

0.40

Max.

6.80

5.50

1.70

6.25

3.00

0.90

2.40

1.50

0.65

*2.30

1.05

Marking:

Pb Free Mark

(Note)

Pb-Free: " . "

Normal: None

0 2 N 6 0 S

Date Code

Control Code

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2.Drain 3.Source

Material:

0.65

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

*: Typical, Unit: mm

3-Lead TO-252 Plastic

Surface Mount Package

HSMC Package Code: J

DIM

Min.

6.40

5.04

Max.

6.80

6.00

5.64

*4.34

0.80

0.90

6.30

2.90

9.80

1.00

0.96

0.86

2.40

1.10

1.22

0.60

2.50

5^o

Marking:

Pb Free Mark

(Note)

Pb-Free: " . "

Normal: None

0 2 N 6 0 S

0.40

0.50

5.90

2.50

9.20

0.60

0.66

2.20

0.70

0.82

0.40

2.10

Date Code

Control Code

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2.Drain 3.Source

G I

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3^o

3-Lead TO-252 Plastic

Surface Mount Package

HSMC Package Code: J

*: Typical, Unit: mm

H02N60SI, H02N60SJ, H02N60SE, H02N60SF

HSMC Product Specification

1 234 5 6

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