GZF3V6C to GZF91C
Vishay Semiconductors
Small Signal Zener Diodes
Features
• Silicon Planar Power Zener Diodes.
• Low profile surface-mount package.
• Low leakage current
e3
• High temperature soldering:
260 °C/10 sec. at terminals
17249
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
Mechanical Data
Case: JEDEC DO-219AB (SMF ) Plastic case
®
Packaging codes/options:
GS18 / 10 K per 13 " reel, (8 mm tape), 50 K/box
GS08 / 3 K per 7 " reel, (8 mm tape), 30 K/box
Weight: approx. 15 mg
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Symbol
Ptot
Value
Unit
mW
Zener current (see Table
"Characteristics")
see
page 2
8001)
Power dissipation
TA = 25 °C
1) Mounted on epoxy glass PCB with 3 x 3 mm, Cu pads (≥ 40 µm thick)
Thermal Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Symbol
RthJA
Value
180
Unit
K/W
Thermal resistance junction to
ambient air1)
Maximum junction temperature
Tj
150
°C
°C
Storage temperature range
TSTG
- 55 to + 150
1) Mounted on epoxy glass PCB with 3 x 3 mm, Cu pads (≥ 40 µm thick)
Document Number 85769
Rev. 1.7, 13-Apr-05
www.vishay.com
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