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GSPS18 PDF预览

GSPS18

更新时间: 2024-02-03 06:43:42
品牌 Logo 应用领域
固锝 - GOOD-ARK 光电二极管
页数 文件大小 规格书
3页 720K
描述
Rectifier Diode, Schottky, 1 Element, 1A, 80V V(RRM), Silicon,

GSPS18 技术参数

生命周期:Active包装说明:R-PDSO-F2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.75
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:R-PDSO-F2
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
最大输出电流:1 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
最大重复峰值反向电压:80 V表面贴装:YES
技术:SCHOTTKY端子形式:FLAT
端子位置:DUALBase Number Matches:1

GSPS18 数据手册

 浏览型号GSPS18的Datasheet PDF文件第2页浏览型号GSPS18的Datasheet PDF文件第3页 
GSPS17 thru GSPS1100  
Surface Mount Schottky Rectifier  
Reverse Voltage 70-100V Forward Current 1.0A  
Features  
• Super Low VF Schottky barrier diodes  
• Low profile, typical thickness 0.8mm  
• Low forward voltage drop  
Package: iSGA  
(SOD-123HS)  
• Low leakage current  
• Moisture sensitivity: level 1, per J-STD-020  
• Heatsink structure  
High temperature soldering guaranteed: 260°C/10 seconds  
Absolute Maximum Ratings (TA=25°C unless otherwise noted  
GSPS17  
GSPS18  
GSPS19  
GSPS1100  
Unit  
Parameter  
Symbol  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
Maximum DC blocking voltage  
Maximum average forward rectified current  
Peak forward surge current 8.3 ms single half sine-  
wave superimposed on rated load  
70  
49  
70  
80  
56  
80  
90  
63  
90  
100  
70  
V
V
V
A
VRRM  
VRMS  
VDC  
100  
1.0  
30  
IF(AV)  
A
IFSM  
A2sec  
I2t  
TJ  
3.8  
Rating for fusing(t8.3ms)  
- 55 to + 150  
- 55 to + 150  
Operating junction temperature range  
Storage temperature range  
TSTG  
Electrical Characteristics (TA=25°C unless otherwise noted  
Value  
Unit  
Parameter  
Test Conditions  
Symbol  
VBR  
100  
0.80  
0.65  
1.0  
Minimum breakdown voltage  
TA=25℃,IR=1mA  
V
IF=1A  
Maximum instantaneous  
forward voltage  
TA=25℃  
VF  
IF=1A TA=125℃  
TA=25℃  
Maximum DC reverse current  
at rated DC blocking voltage  
IR  
uA  
pF  
150  
28  
TA=125℃  
4.0 V, 1 MHz  
CJ  
Typical junction capacitance  
Typical thermal resistance  
1)  
65  
9
juntion to ambient  
juntion to lead  
RθJA  
1)  
℃/W  
RθJL  
2)  
35  
juntion to case  
RθJC  
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB  
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB  
1/3  

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