Datasheet > GRM1882C2A300GA01J

GRM1882C2A300GA01J

更新时间： 2022-06-24 15:43:48

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
30页	782K
描述
Chip Multilayer Ceramic Capacitors for General Purpose

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Substrate Bending Test

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

1.6mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

Land

4.5

Dimension(mm)

Series

GRM18

1.0

3.0

1.2

100

Solder Resist (Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Pressurization Method

50min.

Pressurization speed

1.0mm/s

Pressurize

Flexure

Capacitance meter

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady), Durability

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

1.6mm or 0.8mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

Chip Capacitor

Land

Dimension(mm)

Series

GRM18

1.0

3.0

1.2

Solder Resist

Fig.3

GRM1882C2A300GA01-01A

1 2 3 456 7 8...30

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GRM1882C2A300JA01	MURATA	Chip Multilayer Ceramic Capacitors for General Purpose	获取价格
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GRM1882C2A300JA01D	MURATA	Chip Multilayer Ceramic Capacitors for General Purpose	获取价格
GRM1882C2A300JA01J	MURATA	Chip Multilayer Ceramic Capacitors for General Purpose	获取价格
GRM1882C2A301GA01	MURATA	Chip Multilayer Ceramic Capacitors for General Purpose	获取价格
GRM1882C2A301GA01#	MURATA	民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信	获取价格