Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Item
Specification
No
12 Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
Solder the capacitor on the test substrate A shown in "Complement of Test
method”.
10N, 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
13 Substrate
Bending test
No defects or abnormalities.
Solder the capacitor on the test substrate B shown in "Complement of Test
method”.
Then apply the force in the direction shown in “Test Method of Substrate
Bending test” of “Complement of Test method”.
Flexureꢀ
ꢀꢀꢀ:
1mm
Holding Time ꢀ
Soldering Method
:
5+/-1s
:
Reflow soldering
14
Appearance No defects or abnormalities.
Fix the capacitor to the supporting Test substrate A (glass epoxy board)
shown in “Complement of Test method”.
Perform the 5 cycles according to the four heat treatments
shown in the following table.
Temperature
Sudden Change
Capacitance Within +/-15%
Change
Time
(min)
Step
Temp.(C)
1
2
3
4
30+/-3
Min.Operating Temp.+0/-3
Room Temp
2 to 3
30+/-3
2 to 3
D.F.
I.R.
0.05 max.
Max.Operating Temp.+3/-0
Room Temp
3000MΩ or more
Exposure Time
:
24+/-2h at room condition*.
･Pretreatment
Voltage proof No defects.
Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
15
Appearance No defects or abnormalities.
Fix the capacitor to the supporting Test substrate B (glass epoxy board)
High
shown in “Complement of Test method”.
Temperature
High Humidity
(Steady)
Capacitance Within +/-15%
Change
Before this test, the test shown in the following is performed.
・No.12 Adhesive Strength of Termination(apply force : 5N)
・No.13 Substrate Bending test
D.F.
I.R.
0.05 max.
Test Temperature
Test Humidity
Test Time
:
40+/-2℃
:
90% to 95%RH
500+24/-0h
:
3000MΩ or more
Applied Voltage
Exposure Time
･Pretreatment
:
Rated voltage
24+/-2h at room condition*.
:
Voltage proof No defects.
Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
16 Durability
Appearance No defects or abnormalities.
Fix the capacitor to the supporting Test substrate B (glass epoxy board)
shown in “Complement of Test method”.
Before this test, the test shown in the following is performed.
・No.12 Adhesive Strength of Termination(apply force : 5N)
・No.13 Substrate Bending test
Capacitance Within +/-20%
Change
Next, Impulse Voltage test is performed.
Each individual capacitor shall be subjected to a 5kV Impulse
(the voltage value means zero to peak) for 3 times.
Then the capacitors are applied to life test.
D.F.
I.R.
0.05 max.
Front time (T1) = 1.2μs=1.67T
Time to half-value (T2) = 50μs
3000MΩ or more
Apply voltage as Table for 1000h at 125+2/-0°C , relative humidity 50% max.
Applied voltage
AC425V(r.m.s.) , except that once each hour the voltage is
increased to AC1000V(r.m.s.) for 0.1s.
Voltage proof No defects.
Exposure Time
:
24+/-2h at room condition*.
･Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
*Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
JEMCGS-03013B
3
5秒后页面跳转
pcf8563芯片功能说明、参数分析、引脚说明
TDA2822资料手册：引脚说明、参数分析
TJA1050资料数据分析、引脚说明、应用示例介绍
DS3231时钟芯片：参数分析、引脚说明、应用示例介绍
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
