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FXL5T244 PDF预览

FXL5T244

更新时间: 2024-01-27 13:30:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 转换器
页数 文件大小 规格书
8页 517K
描述
Low Voltage Dual Supply 5-Bit Signal Translator with Configurable Voltage Supplies with Configurable Voltage Supplies

FXL5T244 技术参数

是否无铅:不含铅生命周期:Active
包装说明:HVQCCN, LCC14,.1X.12,20Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
Factory Lead Time:1 week风险等级:1.14
Samacsys Confidence:3Samacsys Status:Released
2D Presentation:https://componentsearchengine.com/2D/0T/4452.2.1.pngSchematic Symbol:https://componentsearchengine.com/symbol.php?partID=4452
PCB Footprint:https://componentsearchengine.com/footprint.php?partID=44523D View:https://componentsearchengine.com/viewer/3D.php?partID=4452
Samacsys PartID:4452Samacsys Image:https://componentsearchengine.com/Images/9/FXL5T244BQX.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/2/FXL5T244BQX.jpgSamacsys Pin Count:15
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Quad Flat No-Lead
Samacsys Footprint Name:MLP 2.5X3 14LSamacsys Released Date:2015-05-24 21:47:42
Is Samacsys:N接口集成电路类型:INTERFACE CIRCUIT
JESD-30 代码:R-XQCC-N14JESD-609代码:e4
长度:3 mm湿度敏感等级:1
功能数量:1端子数量:14
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC14,.1X.12,20封装形状:RECTANGULAR
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.5/3.3 V认证状态:Not Qualified
座面最大高度:0.8 mm子类别:Other Interface ICs
最大供电电压:3.6 V最小供电电压:1.1 V
标称供电电压:1.4 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.5 mmBase Number Matches:1

FXL5T244 数据手册

 浏览型号FXL5T244的Datasheet PDF文件第1页浏览型号FXL5T244的Datasheet PDF文件第3页浏览型号FXL5T244的Datasheet PDF文件第4页浏览型号FXL5T244的Datasheet PDF文件第5页浏览型号FXL5T244的Datasheet PDF文件第6页浏览型号FXL5T244的Datasheet PDF文件第7页 
Terminal Descriptions  
Truth Table  
Terminal  
Names  
Description  
Inputs  
Outputs  
Yn  
OE  
An  
OE  
Output Enable Input  
Data Inputs  
L
L
L
H
X
L
H
An  
Yn  
3-STATE Outputs  
Inputs Power Supply  
Outputs Power Supply  
Ground  
H
3-STATE  
VCCI  
VCCO  
GND  
H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Don’t Care  
Connection Diagram  
Terminal Assignment  
Terminal Number  
Terminal Name  
Terminal Assignments for DQFN  
1
2
3
4
5
6
7
VCCI  
A0  
A1  
A2  
A3  
A4  
GND  
8
OE  
Y4  
9
10  
11  
12  
13  
14  
Y3  
Y2  
Y1  
Y0  
VCCO  
(Top View)  
Power-Up/Power-Down Sequencing  
FXL translators offer an advantage in that either VCC may  
The recommended power-up sequence is the following:  
1. Apply power to either VCC  
be powered up first. This benefit derives from the chip  
design. When either VCC is at 0 volts, outputs are in a  
.
2. Apply power to the OE input (Logic HIGH for A-to-B  
operation; Logic LOW for B-to-A operation) and to the  
respective data inputs (A Port or B Port). This may  
occur at the same time as Step 1.  
HIGH-Impedance state. The control input, OE, is designed  
to track the VCCI supply. A pull-up resistor tying OE to VCCI  
should be used to ensure that bus contention, excessive  
currents, or oscillations do not occur during power-up/  
power-down. The size of the pull-up resistor is based upon  
the current-sinking capability of the OE driver.  
3. Apply power to other VCC  
.
4. Drive the OE input LOW to enable the device.  
The recommended power-down sequence is the following:  
1. Drive OE input HIGH to disable the device.  
2. Remove power from either VCC  
.
3. Remove power from other VCC  
.
www.fairchildsemi.com  
2

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