深圳市长江微电科技有限公司
SZ CJIANG TECHNOLOGY CO.,LTD
Mechanical Reliability
Item
Specification and Requirement
Test Method
1. No case deformation
1.Preheat:155℃±5℃ ,60S±2S
2.Tin: lead-free.
or change in apperarance
Solderability
3.Temperature:240℃±5℃,flux 3.0S±0.5S.
2. New solder coverage
More than 95%
1. No case deformation
1. Acceleration: 100G
Mechanical
shock
or change in apperarance
2. Pulse time::6ms
3. 3 times in each positive and negative direction of 3
mutual perpendicular directions
2. △L/Lo≦±10%
1. Reflow: 2times
1. No case deformation
2. Frequency: 10HZ~55HZ~10HZ,20 Min/Cycles
3. Amplitude: 1.52 mm
Mechanical
vibration
or change in apperarance
4. Directions: X,Y,Z
2. △L/Lo≦±10%
5. Time: 12 cycle / direction
Endurance Reliability
Item
Specification and Requirement
Test Method
1. First -55℃ for 30 minutes,last 125℃ for 30 minutes
as 1 cycle. Go through 1000 cycles.
2. Max transfer time is 3 minutes.
Inductance change:
Within ± 10% Without distinct damage
Thermal Shock
in appearance
3. Measured at room temperature after placing for 24±2
hours
Inductance change:
1.Reflow 2 times,
Humidity
Within ± 10% Without distinct damage 2.85℃,85%RH,1000 hours
Resistance
in appearance
3.Measured at room temperature after placing for 24±2
hours
Inductance change:
1. Temperature:-55 ± 2℃
Low
Within ± 10% Without distinct damage 2. Time:1000 hours
temperature
storage
in appearance
3. Measured at room temperature after placing for 24±2
hours
1. Temperature:+125 ± 2℃
High
Inductance change:
2. Time:1000 hours
temperature
storage
Within ± 10% Without distinct damage
in appearance
3. Measured at room temperature after placing for 24±2
hours
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