Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Volume
Volume
Package
Thick(ess
<2.5mm
mm3
mm3
_
<35ꢀ
235°C
220°C
>35ꢀ
TL
220°C
220°C
Preheat
t
_
>2.5mm
Tsmax
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cc
Volume
Volume
Volume
mm3
>2ꢀꢀꢀ
260°C
245°C
245°C
Tsmin
mm3
mm3
ts
Package
Thick(ess
<1.6mm
<35ꢀ
260°C
1.6 – 2.5mm 260°C
>2.5mm 250°C
35ꢀ - 2ꢀꢀꢀ
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feature
Sta(dard S(Pb Solder Lead ꢁPbH Free Solder
100°C
Preheat and Soak
• Temperature min. (T
)
150°C
smin
• Temperature max. (T
)
150°C
200°C
smax
) (t )
• Time (T
smin
to T
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax s
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T to T
c
)
p
Time 25°C to Peak Temperature
smax
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
North America
Europe
Asia Pacific
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Cooper Bussmann
Cooper Electronic Technologies
Cooper (UK) Limited
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Burton-on-the-Wolds
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Tel: +65 278 6151
Fax: +65 270 4160
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Fax: +34 937 362 719
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
© 2008 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
1208 BU-SB08860
Page 4 of 4
Data Sheet: 4337