Preliminary Data Sheet1.0
FMS2003 ES1
SP4T Bonding Configuration
Pad Number
Port
Symbol
Connection on Board
1
2
3
4
5
6
7
8
9
RF input port 1
DC Control line 1
Antenna*
RF 1
RF4
Vctrl 1
ANT
V1
ANT
V2
DC Control line 3
RF input port 3
RF input port 2
DC Control line 2
Antenna*
Vctrl 3
RF 3
RF5
RF1
V4
RF 2
Vctrl 2
ANT
RF3*
V3
DC Control line 4
RF input port 4
Vctrl 4
RF 4
10
RF2
* Either or both of the antenna pads can be bonded. They are electrically the same.
Bonding Pad Layout
561.9 µm (x)
217.78 µm (x)
455 µm (x)
692.22 µm (x)
853.81 µm (x)
2
3
4
5
1
706.75 µm (y)
706.75 µm (y)
706.75 µm (y)
694.5 µm (y)
694.5 µm (y)
SP4T F1
561.9 µm (x)
853.81 µm (x)
217.78 µm (x)
455 µm (x)
692.22 µm (x)
6
10
7
8
9
145.5 µm (y)
145.5 µm (y)
133.25 µm (y)
133.25 µm (y)
133.25 µm (y)
0.00 µm
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd, Heighington Lane Business Park, Newton Aycliffe, Co Durham. DL5 6JW.
Contact Details: Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filcs.com