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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| FIG.2B.312.CLAD62 | ETC |
获取价格 |
CONN PLUG MALE 12POS SOLDER CUP |
|
| FIG.3B.302.CLAD92 | ETC |
获取价格 |
CONN PLUG MALE 2POS SOLDER CUP |
|
| FI-G30C2 | JAE |
获取价格 |
Board to Cable Connector Compatible to High-Speed Differential Transmission |
|
| FI-G30C2-SH-B2-8000 | JAE |
获取价格 |
Board to Cable Connector Compatible to High-Speed Differential Transmission |
|
| FI-G30S-VF25 | JAE |
获取价格 |
Board to Cable Connector Compatible to High-Speed Differential Transmission |
|
| FI-G30S-VF25R3000 | JAE |
获取价格 |
Board to Cable Connector Compatible to High-Speed Differential Transmission |
|
| FI-G42SB-VF25 | JAE |
获取价格 |
INSULATOR - HEAT RESISRING PLASTIC |
|
| FIHAA01C1F | XPPOWER |
获取价格 |
Chassis Mount Filter |
|
| FIHAA03C1F | XPPOWER |
获取价格 |
Chassis Mount Filter |
|
| FIHAA06C1F | XPPOWER |
获取价格 |
Chassis Mount Filter |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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