WIRE WOUND CHIP INDUCTORS
◆可靠性测试方法 Reliability Test Method
序号
No.
项目
要求
试验方法及备注
Items
Requirements
Test Methods and Remarks
①外观无可见损伤痕迹;
在 245±5℃熔融的焊锡(96.5%Sn/3.0%Ag/0.5%Cu)中浸
置 5±1s。
No visible mechanical damage.
可焊性
1
②端电极表面焊锡覆盖率。
Dip pads in flux and dip in solder
Solder ability
Electrode surface solder coverage.
pot(96.5Sn/3.0Ag/0.5Cu)at 245±5℃ for 5±1s.
FHW-UC/HC series:≥90%。
①外观无可见损伤痕迹;
No visible mechanical damage.
②感量变化不超过±5%;
Inductance shall not change more than
±5%;
在 260±5℃熔融的焊锡(96.5%Sn/
3.0%Ag/0.5%Cu)中浸置 10±1s。
Dip pads in flux and dip in solder
耐焊接热
2
Resistance to Soldering
pot(96.5Sn/3.0Ag/0.5Cu)at 260±5℃ for 10±1s.
③Q 值变化不超过±10%。
Q shall not change more than±10%.
①外观无可见损伤痕迹;
No visible mechanical damage.
②感量变化不超过±5%;
Inductance shall not change more than
±5%;
振幅 1.5mm,频率 10~55Hz,每个方向(X、Y、Z)保持 2
小时。Inductors shall be subjected to vibration of 1.5mm
amplitude frequency 10~55Hz (10Hz to 55Hz to 10Hz in a
period of 1 minute) for 2h in each of three(X、Y、Z) axes.
振动
3
Vibration
③Q 值变化不超过±10%。
Q shall not change more than±10%.
将产品焊在 PCB 板上,按下图、表所示方向及要求施加作
用力。Weld the product on the PCB board, and apply force
as shown in the diagram, direction and requirement.
①试验后端电极无脱落;
The end electrode did not fall off after
the test.
端电极强度
4
Adhesion of electrode
②外观无可见损伤痕迹。
No visible mechanical damage.
尺寸规格 Size
施加力要求
0805UC
20 N
And Above Series.
Keep time: (10±1)s
Speed: 1.0 mm/s.
6