深圳市长江微电科技有限公司
SZ CJIANG TECHNOLOGY CO.,LTD
Mechanical Reliability
Item
Specification and Requirement
Test Method
1. No case deformation
or change in visual
1.Preheat:155℃±5℃ ,60S±2S
2.Tin: lead-free.
Solderability
3.Temperature:240℃±5℃,flux 3.0S±0.5S.
2. New solder coverage
More than 95%
1. No case deformation
or change in visual
1. Acceleration: 100G
Mechanical
shock
2. Pulse time::6ms
3. 3 times in each positive and negative direction of 3
mutual perpendicular directions
2. △L/Lo≦±10%
1. Reflow: 2times
1. No case deformation
or change in visual
2. Frequency: 10HZ~50HZ~10HZ,20 Min/Cycles
3. Amplitude: 1.52 mm±10%
4. Directions: X,Y,Z
Mechanical
vibration
2. △L/Lo≦±10%
5. Time: 12 cycle / direction
Endurance Reliability
Item
Specification and Requirement
Test Method
1. First -55℃ for 30 minutes,last 125℃ for 30 minutes
as 1 cycle. Go through 1000 cycles.
2. Max transfer time is 3 minutes.
Inductance change:
Within ± 10% Without distinct damage
in visual
Thermal Shock
3. Measured at room temperature after placing for 24±2
hours
Inductance change:
1.Reflow 2 times,
Humidity
Within ± 10% Without distinct damage 2.85℃±3℃,85%±3%RH,1000 hours
Resistance
in visual
3.Measured at room temperature after placing for 24±2
hours
Inductance change:
1. Temperature:-55 ± 2℃
Low
temperature
storage
Within ± 10% Without distinct damage 2. Time:1000 hours
in visual
3. Measured at room temperature after placing for 24±2
hours
1. Temperature:+125 ± 2℃
High
Inductance change:
2. Time:1000 hours
temperature
storage
Within ± 10% Without distinct damage
in visual
3. Measured at room temperature after placing for 24±2
hours