Datasheet > FAN3227CMX-F085

FAN3227CMX-F085

更新时间： 2022-02-26 10:13:52

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安森美 - ONSEMI		栅
页数	文件大小	规格书
26页	1767K
描述
Dual 2-A High-Speed, Low-Side Gate Drivers

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FAN3227CMX-F085 数据手册

Package Outlines

Figure 2. 3x3 mm MLP-8 (Top View)

Figure 3. SOIC-8 (Top View)

Thermal Characteristics⁽²⁾

(3)

(4)

(5)

(6)

(7)

Package

8-Lead 3x3 mm Molded Leadless Package (MLP)

8-Pin Small Outline Integrated Circuit (SOIC)

Notes:

Unit

°C/W

Θ_JL

Θ_JT

Θ_JA

Ψ_JB

Ψ_JT

1.6

3.5

0.8

3.0

2. Estimates derived from thermal simulation; actual values depend on the application.

3. Theta_JL (Θ ): Thermal resistance betweenthe semiconductor junction andthe bottom surface of all the leads(including any

thermal pad) that are typically solderedto a PCB.

4. Theta_JT (Θ ): Thermal resistance betweenthe semiconductor junction andthe top surface of the package,assuming it is

held at a uniform temperature by a top-side heatsink.

5. Theta_JA (Θ_JA): Thermal resistance betweenjunction andambient,dependenton the PCB design, heat sinking, and airflow.

The value given isfor natural convection with noheatsinkusing a 2S2P board, asspecifiedin JEDEC standardsJESD51-2,

JESD51-5, and JESD51-7, asappropriate.

6. Psi _JB (Ψ_JB): Thermal characterizationparameter providingcorrelation betweensemiconductor junctiontemperature andan

application circuit board referencepoint for the thermal environment definedin Note 5. For the MLP-8package, the board

reference isdefined asthe PCB copper connectedto the thermal pad andprotrudingfrom either end of the package.For the

SOIC-8 package, the board reference isdefinedasthe PCB copper adjacent to pin 6.

7. Psi _JT (Ψ_JT): Thermal characterizationparameter providingcorrelation betweenthe semiconductor junction temperature and

the center of the top of the package for the thermal environmentdefined in Note5.

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